采用溶胶-凝胶工艺制备2.5D SiO_(2f)/ SiO_2复合材料,并对工艺参数进行了优化.研究表明:以固含量为30.73 %的硅溶胶为浸渍浆料,采用微波干燥方式,烧结温度为900 ℃时制备的复合材料具有较好的性能.经过7个制备周期后,复合材料的密度为1.65 g/cm~3,此时弯曲强度最大,可达80.7 MPa;800 ℃下烧成的材料具有最大的剪切强度和断裂韧性,分别为56.6 MPa和3.5 MPa·m~(1/2).测得试样介电常数为3.4,较好的满足了天线罩材料的介电性能要求.
In this paper, 2.5D SiO_(2f)/ SiO_2 composites were fabricated by sol-gel method with 2.5D silica braid as reinforcement and high pure silicasol as slurry. The optimum parameters are as follows: silicasol of 30.73% as slurry, drying by microwave, sintering at temperature of 900 ℃. The density of composites can reach 1.65 g·cm~(-3), and the maximal flexural strength is 80.68 MPa. The maximum shear strength and fracture toughness are 56.6 MPa and 3.5 MPa·m~(1/2) when the specimen was sintered at 800 ℃. Dielectric properties of 2.5D SiO_(2f)/ SiO_2 composites were also tested. It is 3.4 at 5 GHz and can well meet the requirements of radome materials.
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