研究了不同电流条件下退火冷轧无取向硅钢组织的变化规律。结果表明:电流对硅钢组织有显著影响。在施加直流电流退火条件下,再结晶速度比不施加电流退火时快得多,但施加交流电退火时的再结晶速度比施加直流电流退火时慢。
The change rule of the microstructure of the coldrolled Sisteel annealed under different current was researched. The results show that the current has obvious effect on the microstructure of the Sisteel. Under DC condition the nucleation rate of recrystallization is much higher than that without current and is slightly higher than that annealed with AC current.
参考文献
上一张
下一张
上一张
下一张
计量
- 下载量()
- 访问量()
文章评分
- 您的评分:
-
10%
-
20%
-
30%
-
40%
-
50%