利用离子注入法在一块Si(001)衬底上注入了In+和As+,注入能量分别为210 keV,150 keV,注入剂量6.2×1016cm-2,8.6×1016 cm-2,另一块Si(001)衬底上注入Ga+和Sb+,注入能量分别为140 keV,220 keV,注入剂量分别为8.2×1016 cm-2,6.2×1016 cm-2,然后对样品分别经过一次退火和二次退火处理制备出了Si基量子点材料.用透射电子显微镜(TEM)和高分辨透射电子显微镜(HRTEM)观察了退火后量子点截面像,用PL探测量子点的光致发光谱,发现经二次退火生长的量子点微晶格结构和Si衬底损伤的修复均明显优于一次退火.
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