TFA-MOD方法是制备YBCO涂层导体的最有应用前景的方法之一.本文采用TFA-MOD方法在LaAlO3单晶基片上生长YBCO薄膜并系统地研究了高温退火不同的停留时间对其影响.XRD分析表明退火时间较短时仍有明显的YBCO(00l)取向,但也有其它杂相峰存在,而延长退火时间可以使杂相峰消失而得到纯的且强度更高的YBCO(00l)取向.SEM分析表明未完全结晶的YBCO薄膜表面晶粒大小不一致,而且气孔较多.而结晶良好的YBCO薄膜表面平整致密,空洞较少.随着退火时间的增加YBCO颗粒尺寸在增大.但是,退火时间太长,会有大的空洞,甚至出现裂纹.超导电性能测试表明,随着退火时间的增加超导临界电流(Ic)在增加,但是退火时间达到60min后,Ic即达到最大值,表明60min就能使前驱膜在该实验条件下完全的结晶形成取向良好的YBCO薄膜,YBCO薄膜的生长速度达到0.16nm/s.
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