为了取得贴近切削加工的临界切削厚度,本文提出了一种采用金刚石刀具对KDP晶体进行螺旋刻划、基于所得刻槽微观形貌特征参数计算临界切削厚度的新方法;分析了切削速度和材料各向异性对临界切削厚度的影响;通过切削实验验证所得临界切削厚度.结果表明,晶体材料的各向异性对临界切削厚度有显著影响;在低速切削范围内,切削速度对临界切削厚度影响不显著;基于所得临界切削厚度选择切削参数,实现了KDP晶体全晶向延性域切削,取得了表面粗糙度为2.57 nm(Ra)的超光滑表面.
参考文献
| [1] | 杨福兴.激光核聚变光学元件超精密加工技术的研究[J].光学技术,2003(06):649-651. |
| [2] | 曹先锁,吴东江,王奔,高航,康仁科.KDP晶体各向异性力学特性分析[J].人工晶体学报,2008(03):704-709. |
| [3] | 张艳珍,孙洵,蒋晓东,王波,黄进,陈习权,魏晓峰,许心光.KDP晶体体缺陷和损伤的观测方法研究[J].人工晶体学报,2006(03):545-549. |
| [4] | R K M;I T;M E et al.Influence of Diamond Turning and Surface Cleaning Processes on the Degradation of KDP Crystals Surfaces[J].Proceedings of Spie,1999,1561:59-69. |
| [5] | I M T;M R K;G E et al.Processes for the Elimination of Fogging on KDP Crystals Prior toand Suring Use in Laser Systems[J].Proceedings of Spie,1991,1642:137-148. |
| [6] | Fuchs B A;Hed P P;Baker P C .Fine Diamond Turning of KDP Crystals[J].Applied Optics,1986,25(11):1733-1735. |
| [7] | Yoshiharu N .Ultrapreciaion Grinding of Optical Materials for High Power Lasers[J].Proceedings of Spie,1998,3266:320-330. |
| [8] | 王碧玲,高航,滕晓辑,康仁科.抛光加工参数对KDP晶体材料去除和表面质量的影响[J].人工晶体学报,2010(01):29-33,43. |
| [9] | Menapace J A;Ehrmann P R;Bickel R C et al.Magnetorheolngical Finishing(MRF)of Potassium Dihydrogen Phosphate (KDP)Crystals:Nonaqueous Fluids Development,Optical Finish,and Laser Damage Performance at 1064 nm and 532 nm[J].Proceedings of Spie,2009,7504:750414-1-750414-1. |
| [10] | 王景贺,陈明君,董申,张龙江.KDP晶体单点金刚石切削脆塑转变机理的研究[J].光电工程,2005(07):67-70,88. |
| [11] | Blackley W S;Scattergood R O .Ductile-regime Machining Model for Diamond Turning of Brittle Materials[J].Precision Engineering,1991,13(02):95-103. |
| [12] | Cai M B;Li XP;Rahman M .High-pressure Phase Transformation as the Mechanism of Ductile Cutting Formation in Nanoscale Cutting of Silicon Wafer[J].Journal of Engineering Manufacture,2007,211(10):1511-1519. |
上一张
下一张
上一张
下一张
计量
- 下载量()
- 访问量()
文章评分
- 您的评分：
-
10%
-
20%
-
30%
-
40%
-
50%