在90℃下使用对枯烯基苯酚对氰酸酯进行改性,并用对枯烯基苯酚改性氰酸酯与氰酸酯、环氧树脂复配制作覆铜箔层压板,并对其性能进行测试分析.结果表明:制得的覆铜板层压板在1 GHz测试条件下介电常数为3.78～3.87,介质损耗因数为0.007 5～0.009 3;其介电性能比采用未改性氰酸酯制作的覆铜箔层压板的更优.
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