阐述了物质绝缘、导热的机理.介绍了绝缘导热塑料、橡胶、胶粘剂和涂层的具体应用.从填料方面(包括单组分型及多组分型)概述了聚合物基绝缘导热复合材料的研究进展.通过对比单组分型和多组分型复合材料的优缺点并结合工业化生产成本,指出聚合物基绝缘导热复合材料将成为今后研究的重点.
参考文献
[1] | Ming-xia Shen;Yin-xin Cui;Jing He .Thermal conductivity model of filled polymer composites[J].International Journal of Minerals,Metallurgy and Materials,2011(5):623-631. |
[2] | 童奇勇,李光吉.PP/滑石粉导热绝缘复合材料的制备与性能研究[J].中国塑料,2008(07):32-36. |
[3] | 周柳 .环氧树脂基导热绝缘复合材料的制备与性能研究[D].武汉理工大学,2008. |
[4] | Huang, X.;Jiang, P.;Tanaka, T. .A review of dielectric polymer composites with high thermal conductivity[J].IEEE Electrical Insulation Magazine,2011(4):8-16. |
[5] | Yongcun Zhou;Hong Wang;Lu Wang .Fabrication and characterization of aluminum nitride polymer matrix composites with high thermal conductivity and low dielectric constant for electronic packaging[J].Materials Science & Engineering, B. Solid-State Materials for Advanced Technology,2012(11):892-896. |
[6] | 杨文彬,张凯,杨序平,白进伟,周元林.BN/聚砜导热绝缘复合材料的制备及性能[J].西南科技大学学报,2011(01):24-27. |
[7] | Zhou, W. .Thermal and dielectric properties of the AlN particles reinforced linear low-density polyethylene composites[J].Thermochimica Acta: An International Journal Concerned with the Broader Aspects of Thermochemistry and Its Applications to Chemical Problems,2011(1/2):183-188. |
[8] | 陶慧,陈双俊,张军.改性绢云母对顺丁橡胶导热性能的影响[J].橡胶工业,2012(04):201-207. |
[9] | Yongxi Zhang;Xiangyang Hu;Jian H. Zhao;Kuang Sheng;W. Roger Cannon;Xiaohui Wang;Leonid Fursin .Rheology and Thermal Conductivity of Diamond Powder-Filled Liquid Epoxy Encapsulants for Electronic Packaging[J].IEEE transactions on components and packaging technologies: A publication of the IEEE Components, Packaging, and Manufacturing Technology Society,2009(4):716-723. |
[10] | Abyzov, A.M.;Kidalov, S.V.;Shakhov, F.M. .Thermal conductivity of the diamond-paraffin wax composite[J].Physics of the solid state,2011(1):48-52. |
[11] | Zhou Wenying;Qi Shuhua;Li Haidong et al.Study on insulating thermal conductive BN/HDPE composites[J].Thermochimica Acta,2007,452:36. |
[12] | 牟其伍;孔岩岩 .AlN/EP导热绝缘灌封材料的制备及性能研究[J].材料导报,2011,25(专辑18):182. |
[13] | Kemaloglu, S;Ozkoc, G;Aytac, A .Properties of thermally conductive micro and nano size boron nitride reinforced silicon rubber composites[J].Thermochimica Acta: An International Journal Concerned with the Broader Aspects of Thermochemistry and Its Applications to Chemical Problems,2010(1/2):40-47. |
[14] | Zhou Wenying;Yu Demei;An Qunli .A novel polymeric coating with high thermal conductivity[J].Polymer-Plastics Technology and Engineering,2009,48(10-12):1230. |
[15] | Gu Junwei;Zhang Qiuyu;Dang Jing et al.Thermal conductivity epoxy resin composites filled with boron nitride[J].Polymers For Advanced Technologies,2012,23:1025. |
[16] | He Hong;Fu Renli;Han Yanchun et al.High thermal conductive Si3 N4 particle filled epoxy composites with a novel structure[J].ASME Journal of Electronic Packaging,2007,129:469. |
[17] | 任芳,任鹏刚,狄莹莹.导热LLDPE/SiC复合材料的性能研究[J].化工新型材料,2010(10):94-97. |
[18] | 王聪.环氧树脂/氧化铝导热复合材料的结构设计和制备[J].绝缘材料,2010(01):52-55. |
[19] | Kozako M;Okazaki Y;Hikita M.Preparation and evaluation of epoxy composite insulating materials toward high thermal conductivity[A].Potsdam,Germany,2010 |
[20] | Ohki, Y. .Development of epoxy resin composites with high thermal conductivity[J].IEEE Electrical Insulation Magazine,2010(1):48-49. |
[21] | 程宪涛,姜宏伟.氧化铝的表面改性及其在导热有机硅灌封胶中的应用[J].有机硅材料,2012(03):148-152. |
[22] | Simon Konzelmann;Christian Hoffmann;Ralf Merte;Dirk Peier .Thermal and Electrical Properties of Aluminum Nitride Filled Epoxy-resin Compound[J].IEEE transactions on dielectrics and electrical insulation: A publication of the IEEE Dielectrics and Electrical Insulation Society,2008(2):327-333. |
[23] | 吕勇,罗世永,陈萌,许文才.金刚石粉/环氧树脂胶粘剂的制备和导热性能[J].化工新型材料,2009(10):66-67,109. |
[24] | 罗世永;吕勇;李悦 .金刚石/环氧树脂胶粘剂的导热性能[J].北京工业大学学报,2010,36(06):819. |
[25] | 吴江涛,齐暑华,李珺鹏.环氧树脂/玻纤/BN导热绝缘复合材料制备研究[J].粘接,2011(03):68-70. |
[26] | Zhou WY;Qi SH;Zhao HZ;Liu NL .Thermally conductive silicone rubber reinforced with boron nitride particle[J].Polymer Composites,2007(1):23-28. |
[27] | 刘传超,范和平,李桢林,杨蓓.高导热铝基板用导热绝缘胶的制备[J].印制电路信息,2011(z1):13-18. |
[28] | Tanaka T;Wang Zengbin;Iizuka T.High thermal conductivity epoxy/BN composites with sufficient dielectric breakdown strength[A].香港,2011 |
[29] | Wang Zengbin;Iizuka T;Kozako M et al.Development of epoxy/BN composites with high thermal conductivity and sufficient dielectric breakdown strength.Part Ⅰ-Sample preparations and thermal conductivity[J].IEEE Trans Dielectrics Electrical Insulation,2011,18(06):1963. |
[30] | Wang Zengbin;Iizuka T;Kozako M et al.Development of epoxy/BN composites with high thermal conductivity and sufficient dielectric breakdown strength.Part Ⅱ-Breakdown strength[J].IEEE Trans Dielectrics Electrical Insulation,2011,18(06):1973. |
上一张
下一张
上一张
下一张
计量
- 下载量()
- 访问量()
文章评分
- 您的评分:
-
10%
-
20%
-
30%
-
40%
-
50%