讨论了碱性化学镀铜成分中CuSO4、还原剂HCHO以及NaOH的浓度对化学镀效果的影响,得到了适合超大规模集成电路铜金属化的化学镀溶液成分.然后研究了酸性和碱性化学镀铜结合方法在铜布线制造方面的应用.首先采用分离酸性化学镀方法在TiNi/Ti/SiO2/Si基板的TiN进行化学镀,制造一层铜籽晶层,而后采用碱性化学镀铜方法制造铜膜.通过对化学镀铜膜形貌和结晶方面的研究发现:籽晶层对铜膜最终形貌和择优取向有较大的影响.
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