利用静滴法研究了Sn-Cu-Ag/Cu体系熔融焊料的润湿机理,结果发现,700 K是合金焊料铺展机理的转折点.利用DTA分析方法研究了界面反应,采用Kissinger方法计算了界面反应热动力学参数,另外,还研究了元素Cu对提高Sn-Ag-Cu/Cu体系界面反应活化能的影响及对界面反应速率的抑制作用.
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