金属材料及其合金的同系温度超过0.5时,蠕变成为材料变形的主导机理.钎料合金熔点较低,因而在极低温度下也可能发生蠕变变形.本文以Pb5Sn钎料为例,系统地测试了该钎料在-40℃~120℃范围内的蠕变特性,并提出了一套考虑更广温度、应力范围的钎料蠕变本构关系.数值仿真算例表明,在电子封装芯片可靠性评价中忽略钎料的低温蠕变可能导致结果的显著误差.
参考文献
[1] | Ma, H;Suhling, JC .A review of mechanical properties of lead-free solders for electronic packaging[J].Journal of Materials Science,2009(5):1141-1158. |
[2] | Katsuaki Suganuma .Advances in lead-free electronics soldering[J].Current opinion in solid state & materials science,2001(1):55-64. |
[3] | Darveaux R.;Banerji K. .Constitutive relations for tin-based solder joints[J].IEEE transactions on components, hybrids, and manufacturing technology,1992(6):1013-1024. |
[4] | 郦剑,罗娟,罗来马,俞佳,朱流.硬质合金与钢基体钎焊技术的研究进展[J].材料科学与工程学报,2009(06):955-958. |
[5] | 马晓春,楼程华,肖延令.优质节锡钎料的研制[J].材料科学与工程,1999(04):91-92. |
[6] | Pang J H L;Xiong B;Low T.Creep and fatigue characterization of lead free 95.5 Sn-3.8 Ag-0.7 Cu solder[A].,2004:1333-1337. |
[7] | McLean M .On the threshold stress for dislocation creep in particle strengthened alloys[J].Acta Metallurgica,1985,33:545-556. |
[8] | Wiese S.;Feustel F.;Meusel E. .Characterisation of constitutive behaviour of SnAg, SnAgCu and SnPb solder in flip chip joints[J].Sensors and Actuators, A. Physical,2002(1/2):188-193. |
[9] | Schubert A;Dudek R;Auerswald E;Gollhardt A,Michel B,Reichl H.Fatigue life models for SnAgCu and SnPb solder joints evaluated by experiments and simulation[A].,2003:603-610. |
[10] | Courtney T.Mechanical Behavior of Materials[M].New York:McGraw-Hill,1990:293-314. |
[11] | S. Wiese;S. Rzepka .Time-independent elastic-plastic behaviour of solder materials[J].Microelectronics and reliability,2004(12):1893-1900. |
[12] | Syed A.Accumulated creep strain and energy density based thermal fatigue life prediction models for SnAgCu solder joints[A].,2004:737-746. |
上一张
下一张
上一张
下一张
计量
- 下载量()
- 访问量()
文章评分
- 您的评分:
-
10%
-
20%
-
30%
-
40%
-
50%