简述了高强度导电铜基材料的设计思路,分析了时效强化、颗粒强化以及形变复合等3类铜基材料的制备方法和特点,综述了高强度导电铜基材料的研究现状,并展望了其进一步发展的趋势.
参考文献
[1] | Hysmans P .[J].METALL,2000,54(04):184. |
[2] | Kang S K;Purushothaman S .[J].Journal of Electronic Materials,1999,28(11):1314. |
[3] | 黄崇祺.轮轨高速电气化铁路接触网用接触线的研究[J].中国铁道科学,2001(01):1-5. |
[4] | 陈文革;谷臣清 .[J].电气技术,1997,2:12. |
[5] | 张生龙,尹志民.高强高导铜合金设计思路及其应用[J].材料导报,2003(11):26-29. |
[6] | 张雷,颜芳,孟亮.高强高导Cu-Ag合金的研究现状与展望[J].材料导报,2003(05):15-17,54. |
[7] | 赵冬梅,董企铭,刘平,金志浩,黄金亮.铜合金引线框架材料的发展*[J].材料导报,2001(05):18-20. |
[8] | 闵光辉;宋立;于化顺 .[J].功能材料,1997,28(04):342. |
[9] | 曾汉民.高技术新材料要览[M].北京:中国科学技术出版社,1993:110. |
[10] | Grant N J.High conductivity copper and aluminum alloys[M].Los Angeles:California,1984:103. |
[11] | 程建奕,汪明朴.高强高导高耐热弥散强化铜合金的研究现状[J].材料导报,2004(02):38-41. |
[12] | Ghosh G;Miyake J;Finhe W E .[J].Journal of The Minerals,Metals & Materials Society,1997,49(03):56. |
[13] | SMITH C S.A search for structure[M].MIT Press,1981 |
[14] | Groza J .[J].Journal of Materials Engineering and Performance,1992,1(01):113. |
[15] | Patel A N;Diamond S .[J].Materials Science and Engineering,1988,98:329. |
[16] | 中国机械工程学会焊接学会.电阻焊理论与实践[M].北京:机械工业出版社,1994 |
[17] | 赵祖德.铜及铜合金材料手册[M].北京:科学出版社,1993:133. |
[18] | Szablewski J;Kuznicka B .[J].Materials Science and Technology,1991,7(05):407. |
[19] | Morris D G;Morris M A .[J].Materials Science and Engineering,1988,104A:201. |
[20] | Tenwick M J;Davies H A .[J].Materials Science and Engineering,1988,98A:543. |
[21] | Morris M A;Morris D G .[J].Acta Materialia,1987,35(10):2511. |
[22] | 刘平;康布熙;曹兴国 等.[J].金属学报,1999,35(06):561. |
[23] | Patel A N;Diamond S .[J].Materials Science and Engineering,1988,98A:329. |
[24] | Morris M A;Morris D G .[J].Materials Science and Engineering,1989,111A:115. |
[25] | HU Lian-xi,WANG Xiao-lin,WANG Er-de.Fabrication of high strength conductivity submicroncrystalline Cu-5 % Cr alloy by mechanical alloying[J].中国有色金属学会会刊(英文版),2000(02):209-212. |
[26] | Suzuki H G;Takeuchi T;Mihara K.Proceedings of the TMS Fall Meeting[C].,1998:3597. |
[27] | Kubisch D G;Courtney T H .[J].Metallurgical and Materials Transactions,1986,17A(07):1165. |
[28] | Song JS.;Kim HS.;Hong SI.;Ahn JH. .Comparison of microstructure and strength in wire-drawn and rolled Cu-9Fe-1.2 Ag filamentary microcomposite[J].Journal of Materials Science,2001(24):5881-5884. |
[29] | Cahn R W;吴人沽.复合材料的结构与性能[M].北京:北京科学技术出版社,1999:116. |
[30] | Everett R K;Arsenault R J.Metal matrix composites:mechanisms and properties[M].Academic Press,1991:101. |
[31] | Verhoeven J D;Gibson E D;Ellis T W .[J].Key Engineering Materials,1995,104-107:483. |
[32] | Funkenbusch P D;Courtney T H .[J].Acta Materialia,1985,33(05):913. |
[33] | Spitzig W A;Pelton A R;Laabs F C .[J].Acta Materialia,1987,359(10):2427. |
[34] | Funkenbusch P D;Courtney T H .[J].Acta Materialia,1985,33(05):913. |
[35] | Funkenbusch P D;Courtney T H .[J].Scripta Metallurgica et Materialia,1989,23(10):17194. |
[36] | Verhoeven J D;Downing H L;Chunbley L S .[J].Journal of Applied Physics,1989,65(03):1293. |
[37] | Spitzig W A;Downing H L;Laabs G V .[J].Metallurgical and Materials Transactions,1993,24A(01):7. |
[38] | 刘兴军.[A].北京:冶金工业出版社,2000:109. |
[39] | 谢建新;王自东;吴春京 .[J].北京科技大学学报,1998,20(06):5569. |
[40] | Spitzig W A;Laabs F C;Downing H L .[J].Materials and Manufacturing Processes,1992,7(01):1. |
[41] | Ellis T W;Anderson I E;Downing H L .[J].Metallurgical and Materials Transactions,1993,24A(01):21. |
[42] | Everett R K;Arsenault R J.Metal matrix composites: processing and interfaces[M].Academic Press,1991:155. |
[43] | Jinglei LIU,Zuyan LIU,Erde WANG.Deformation Processed Cu-15 wt pct Cr Composite Synthesized by Hot Hydrostatic Extrusion of Mechanical Milled Powders[J].材料科学技术学报(英文版),2003(05):507-508. |
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