欢迎登录材料期刊网

材料期刊网

高级检索

采用射频磁控溅射法制备HfSi_xO_y薄膜,系统研究工艺参数对HfSi_xO_y薄膜沉积速率的影响规律.对沉积态和退火HfO_2和HfSi_xO_y薄膜的结构进行了对比分析.结果表明:HfSi_xO_y薄膜的沉积速率随射频功率、Ar气体流量和粘贴Si面积的增大而增大,随溅射气压的增大而减小.衬底未加热时,制备的HfSi_xO_y和HfO_2薄膜均呈非晶态,随着衬底加热温度的上升,HfO_2薄膜呈多晶态,而HfSi_xO_y薄膜呈非晶态.HfSi_xO_y薄膜在800℃退火后仍呈非晶态,而HfO_2薄膜在400℃退火后已明显晶化,这表明HfSi_xO_y薄膜具有较高的热稳定性.

参考文献

[1] Melliar C M.[J].Bell Labs Techn,1997(02):15.
[2] Dennard R.[J].IEEE Journal of Solid-State Circuits,1974(09):256.
[3] Lo S.-H.;Buchanan D.A. .Quantum-mechanical modeling of electron tunneling current from the inversion layer of ultra-thin-oxide nMOSFET's[J].IEEE Electron Device Letters,1997(5):209-211.
[4] 赵毅.高K栅介质研究进展[J].半导体技术,2004(05):16-19.
[5] Renault O et al.[J].Journal of Non-Crystalline Solids,2007,353:635.
[6] Cho M H et al.[J].Applied Physics Letters,2006,89:142908.
[7] Kazuyuki Tomida et al.[J].Applied Physics Letters,2006,89:142902.
[8] Ran Jiang et al.[J].Applied Physics Letters,2006,89:142909.
[9] Andrei Zenkevich et al.[J].Applied Physics Letters,2006,89:172903.
[10] Chandan B et al.[J].Applied Physics Letters,2006,89:162903.
[11] 严一心.薄膜技术[M].Beijing:Publish of Enginery Industry,1994
[12] Pant G et al.[J].Applied Physics Letters,2006,89:032904.
[13] Young C.D.;Zeitzoff P.;Brown G.A.;Bersuker G.;Byoung Hun Lee;Hauser J.R. .Intrinsic mobility evaluation of high-/spl kappa/ gate dielectric transistors using pulsed I/sub d/-V/sub g/[J].IEEE Electron Device Letters,2005(8):586-589.
[14] Quevedo-Lopez M A;Krishnan S A et al.[J].Applied Physics Letters,2005,87:262902.
[15] Neumayer D A .[J].Journal of Applied Physics,2001,90:48.
上一张 下一张
上一张 下一张
计量
  • 下载量()
  • 访问量()
文章评分
  • 您的评分:
  • 1
    0%
  • 2
    0%
  • 3
    0%
  • 4
    0%
  • 5
    0%