研究了不同硼硅玻璃配方及相关工艺对低温烧结(1000和1050℃下烧结)ZnO玻璃系压敏陶瓷致密化过程和电气性能的影响.发现含较多PbO和少量ZnO的G1玻璃具有较合适的软化点温度和较好的晶粒润湿性,对应试样的电气性能最好:坯体初始密度、保温时间、降温速率和烧结气氛都显著影响着试样的烧结性能和电气性能.
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