耐高温有机保焊剂的研究

电镀与涂饰 , 2014, 33(24): 1056-1.

耐高温有机保焊剂的研究

阚丽丽 ^1, , 聂浩宇 ^2, , 王秀昀 ^3, , 张广昊 ^4, , 陈厚和 ^5,

1.南京理工大学,江苏南京,210094

2.南京理工大学,江苏南京,210094

3.南京理工大学,江苏南京,210094

4.南京理工大学,江苏南京,210094

5.南京理工大学,江苏南京,210094

关键词：印制线路板 , 铜 , 有机保焊剂 , 苯并咪唑 , 稳定性 , 防腐 , 热冲击

Study on high-temperature-resistant organic solderability preservative

Keywords： printed circuit board , copper , organic solderability preservative , benzimidazole , stability , corrosion protection , thermal shock

以苯并咪唑和糖类聚合物PS为成膜物质,甲酸-醋酸为主要溶剂,制备了水性有机保焊剂(OSP).研究了影响OSP稳定性以及OSP处理后印制线路板(PCB)抗氧化性的主要因素,获得了优化的OSP配方为:苯并咪唑1.5％,PS 0.45％,甲酸-醋酸7.5％,CuSOa·5H2O 0.4％,水余量;pH 4.3.该OSP可在室温稳定贮存30 d以上.PCB于45℃下在其中浸渍处理1 min后,在室温下的抗氧化时间可达15d,在300℃高温下能抵抗10s的热冲击3次,满足高温无铅焊接的要求.

参考文献

[1]	K. HANNIGAN;M. REID;M.N. COLLINS;E. DALTON;C. XU;B. WRIGHT;K. DEMIRKAN;R.L. OPILA;W.D. REENTS;J.P. FRANEY;D.A. FLEMING;J. PUNCH .Corrosion of RoHS-Compliant Surface Finishes in Corrosive Mixed Flowing Gas Environments[J].Journal of Electronic Materials,2012(3):611-623.
[2]	林原标;钟新兴 .有机保焊剂预浸处理剂及有机保焊膜成形方法[P].CN,101508051,2009-08-19.
[3]	Mauricio Ramirez;Lothar Henneken;Sannakaisa Virtanen .Oxidation kinetics of thin copper films and wetting behaviour of copper and Organic Solderability Preservatives (OSP) with lead-free solder[J].Applied Surface Science: A Journal Devoted to the Properties of Interfaces in Relation to the Synthesis and Behaviour of Materials,2011(15):6481-6488.
[4]	LARSON B;PAW W .Precoat composition for organic solderability preservative[P].US,2007/0221503,2007-09-27.
[5]	陈世金.选择性OSP中异色问题的研究和改善[J].印制电路信息,2012(02):59-63.

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耐高温有机保焊剂的研究

Study on high-temperature-resistant organic solderability preservative

参考文献