针对Z-pin增强复合材料层合板,开展了断裂韧性的试验研究.研究选取了3种Z-pin直径(0.28、0.52、0.80 mm)且每种直径下分别以3种分布形式(5×5、8×8、10×10)排布Z-pin的增强方式,为了确定比较基准,试验中同时测试了不含Z-pin的复合材料层合板试样.通过Z-pin拔出试验测试了3种直径Z-pin从基体拔出过程中的载荷-位移关系.利用双悬臂梁试验和端部开口弯曲试验分别测试了不含Z-pin和含Z-pin试样的Ⅰ型断裂应变能释放率GIC、Ⅱ型断裂应变能释放率GⅡC.试验结果表明:与不含Z-pin的结构相比,Z-pin增强试样的Ⅰ型断裂应变能释放率GIC增大了83%～1110%,Ⅱ型断裂应变能释放率GⅡC增大了23%～438%;在相同Z-pin体积含量下,与增大Z-pin直径相比,增大Z-pin分布密度能更有效地提高复合材料层合板的断裂韧性.
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