对等离子法制备的400 nm厚Cu膜-Si(100)基底系统(退火温度为300 ℃)进行了纳米压入实验,目的是寻找一种可靠的软金属薄膜本征模量的评定方法.研究结果表明:基于等模量假设的计算方法可以有效避免材料堆积行为和最小化基底效应对薄膜弹性模量评定的显著影响.结合使用连续刚度测试(CSM)技术,Oliver-Pharr分析法中材料蠕变及热漂移行为的误差影响因素也被消除.利用这种方法得到的Cu膜弹性模量为(92.2±1.8)GPa,和文献值符合较好.与通用的利用数学模型从复合模量中分离出薄膜模量的方法相比,这种方法更为准确和简便.
参考文献
| [1] | Espinosa HD.;Prorok BC. .Size effects on the mechanical behavior of gold thin films[J].Journal of Materials Science,2003(20):4125-4128. |
| [2] | Hong S H;Kim K S;Kim Y M et al.[J].Composites Science and Technology,2005,65:1401. |
| [3] | Beegan D;Laugier MT .Application of composite hardness models to copper thin film hardness measurement[J].Surface & Coatings Technology,2005(1):32-37. |
| [4] | Oliver W C;Pharr G M .[J].Journal of Materials Research,2004,19(01):3. |
| [5] | Chudoba T;Richter F .[J].Surface and Coatings Technology,2001,148:191. |
| [6] | Saha R;Nix W D .[J].Acta Materialia,2002,50:23. |
| [7] | Lin J F;Wei P J;Pan J C et al.[J].Diamond and Related Materials,2004,13:44. |
| [8] | Oliver W C;Pharr G M .[J].Journal of Materials Research,1992,7(06):1564. |
| [9] | Joslin D L;Oliver W C .[J].Journal of Materials Research,1990,5(01):123. |
| [10] | Fang T H;Chang W J .[J].Microelectronic Engineering,2003,65:237. |
| [11] | Yi T;Kim C J .[J].Measurement Science and Technology,1999,10:714. |
| [12] | Grillo S E;Ducarroir M;Nadal M et al.[J].Journal of Physics D:Applied Physics,2003,36:L6. |
| [13] | Gouldstone A;Koh H J;Zeng K Y et al.[J].Acta Materialia,2000,48:2277. |
上一张
下一张
上一张
下一张
计量
- 下载量()
- 访问量()
文章评分
- 您的评分：
-
10%
-
20%
-
30%
-
40%
-
50%