固体电解质(玻璃)与硅的阳极连接机理及界面分析

材料导报, 2006, 20(z1): 356-358.

1.太原理工大学材料科学与工程学院,太原,030024

2.太原理工大学材料科学与工程学院,太原,030024

3.太原理工大学材料科学与工程学院,太原,030024

4.太原理工大学材料科学与工程学院,太原,030024

基金项目: 山西省自然科学基金(20031051) 国家自然科学基金(50375015)

Interfacial Structure and Joining Mechanism of Anodic Bonding

固体电解质(玻璃)与硅片通过阳极连接可以实现良好键合.采用SEM和EDS对界面结构进行了分析.连接的过程与由耗尽层产生的静电场力有紧密关系,通过建立的模型分析了电场力产生的原因.实验表明:温度、压力、连接时间、表面光洁度、电压是影响连接质量的重要因素,优化连接参数是形成良好连接界面的前提.

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