采用粉末冶金技术制备了不同Si含量(0,0.1,0.3 wt％Si)的Mo-Si合金板材,并在25,300,800和1200℃下进行了静拉伸试验,研究了试验温度对Mo-Si合金板材力学性能、断裂方式及微观组织的影响.结果表明:随试验温度升高,纯钼及Mo-Si合金板材强度明显下降,但延伸率以300℃为分界点呈现出先升后降的趋势.室温下Mo-Si合金的断裂方式为穿晶解理断裂,在300及800℃时主要为韧窝延性断裂,而1200℃时为沿晶断裂.对Mo-Si合金强化机制的分析表明,室温下的强化主要来源于弥散强化和固溶强化,而在高温时,固溶作用明显减弱,颗粒弥散和粗化晶粒为主要的强化手段.
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