以氮化铝为导热填料对环氧树脂进行填充改性，制备铝基覆铜板。研究氮化铝的填充量对铝基板绝缘层耐电压、热导率以及剥离强度的影响。对氮化铝进行表面处理，并对处理后的氮化铝对铝基板绝缘层性能的影响进行分析。结果表明：绝缘层的热导率随氮化铝填充量的增加而增大，在填充量大于40%时呈现快速增长，而剥离强度随填充量的增加而降低，耐电压性能在高填充时急剧下降；对氮化铝进行表面处理能显著提高绝缘层在高填充下的耐电压性能，同时剥离强度也得到明显改善。
Using aluminum nitride powder as conductive filler to modify epoxy resin, we prepared an aluminum based copper clad laminate. The effects of aluminum nitride content on the Hi-pot, thermal conductivity, and peel strength of the insulating layer of the aluminum based copper clad laminate were studied, and the effects of treated aluminum nitride on the properties of the insulating layer were analyzed. The results show that the thermal conductivity of the insulating layer increases with the increase of aluminum nitride content, and the thermal conductivity increases rapidly after the filling content is greater than 40%. The peel strength between the insulating layer and copper foil decreases, and the Hi-pot decreases sharply at high filling content. The Hi-pot and peel strength are improved greatly at high filling content after the aluminum nitride was treated.
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