为研究新型Ni-Cr-W合金的扩散连接界面组织特征,采用Cu、Ni、Cu/Ni/Cu箔作中间层,在950℃、30 MPa、45 min条件下利用真空扩散连接技术对此合金进行了焊接,并与直接扩散连接形成对比,分析了不同中间层材料对新型Ni基合金扩散连接界面显微组织及元素扩散浓度分布的影响.结果表明:直接扩散连接接头处存在明显的孔洞及二次碳化物M23C6,阻碍了元素的充分扩散,连接界面质量较差;采用Cu箔中间层时,界面连接良好且形成了厚度为1.3 μm的反应层;以Ni箔作中间层时,扩散界面连接良好但无明显反应层存在;而以Cu/Ni/Cu作中间层时,Ni-Cr-W/Cu界面上有较薄反应层生成,Cu/Ni界面则形成厚度达9μm的无限固溶体层,对比分析表明,高温合金晶界处M23C6的大量析出严重阻碍了Cu原子的扩散.
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