采用非贵金属活化预处理对TiC陶瓷粉体进行化学镀前处理,预处理后通过常温超声波辅助化学镀方法成功制备了Ni包覆TiC陶瓷粉体,通过场发射扫描电子显微镜(FE-SEM)和能谱(EDS)研究分析了原始TiC粉体、非贵金属活化预处理后TiC粉体和Ni包覆TiC粉体表面形貌,探讨了化学镀Ni包覆TiC陶瓷粉体的生长机理.结果表明:非贵金属活化预处理后TiC陶瓷粉体表面出现了大量的缺陷(台阶),化学镀Ni包覆TiC陶瓷粉体表面Ni层覆盖完整、致密均匀;Ni颗粒的形核、长大和聚集的过程为:化学镀溶液中的反应物在TiC表面缺陷上吸附,发生氧化-还原反应沉积出Ni颗粒;Ni颗粒依附“线条状”突起以“线型”方式长大、弯曲、分叉和聚集,而后缠绕成“胞状”结构,犹如“缠毛线团”.“胞状”结构Ni颗粒不断长大聚集,最后成膜.
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