在Cu基底上制备了宽度为200 m的非润湿线, SnAgCu无铅焊膏回流过程中形成的钎料液体在非润湿线上发生去润湿. 对印刷不同厚度锡膏样品回流过程中液体形态的原位观察发现, 焊膏厚度由950 m减小时, 回流液体球冠沿非润湿线分离的长度增加, 当焊膏厚度达到350 m时, 液体被彻底分割为两部分. 通过一个简单模型并运用界面能最小化分析, 给出了非润湿线宽度与液体临界高度之间的关系, 理论分析与实验结果基本一致, 间接反映了微电子钎焊连接中发生桥接的本质.
Specific non-wetting lines with a definite width of 200 μm were prepared on copper substrates. The dewetting of SnAgCu lead-free liquids on the non-wetting line were observed and recorded in-situ during the reflow of the samples. It was found that the shapes of the solder liquids varied with the height of the printed solder paste. As the height decreasing from 950 μm, the separation length of the liquid along the non-wetting line was elongated gradually. For the solder paste with a height of 350 μm, the liquid sphere cap was completely separated by the non-wetting line. The dependence of the critical height of the solder liquid on the width of non-wetting line was proposed based on interfacial energy minimization. The experimental data was comparable. These results gave a clear hint on the origin of solder bridge.
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