研究了传统烧结与热压烧结对ZnO压敏陶瓷显微结构和电性能的影响.采用扫描电镜观察(SEM)、电流-电压测试(I-V)、电容-偏压测试(C-V)以及阻抗谱等分析方法或测试手段研究了陶瓷的显微结构、电性能.结果表明,热压烧结增大了ZnO压敏陶瓷的烧结密度,提高了电性能.晶界特性参数测试结果表明,热压烧结还可以增强晶界特性.
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