采用熔融冷却法制备了Bi2O3-SiO2-B2O3-ZnO系无铅低熔玻璃粉,固定浆料配比及制备工艺,将无铅玻璃粉、自制银粉和有机载体混合,经三辊碾磨机轧制成无铅导电银浆料.银浆料通过丝网印刷法印刷在玻璃基体上,在指定温度下保温烧结.采用XRD、DTA和SEM等手段分析了成分变化对无铅低熔玻璃粉软化温度和析晶温度的影响;采用差热分析法(TG、DTA)、SEM、四探针法、焊接法等研究了烧结温度和保温时间对烧成银膜导电性和附着力的影响.结果表明:无铅低熔玻璃粉中n(Bi3+);n(Si4+);n(B3+);n(Zn2+)=40∶20∶30∶10,银浆料的最佳烧结温度为700℃,最佳保温时间为15 min.
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