研究了不同Pd~(2+)含量的镀液在多孔陶瓷载体上的化学沉积规律,发现当Pd沉积层厚度达到约5μm后,即使镀液中反应物的消耗比例很小,膜厚增长也明显变缓,沉积反应主要受膜层表面的催化活性位控制;当镀液中Pd~(2+)含量只能沉积形成小于4μm的Pd膜时,在323K化学镀180min后,镀液中Pd~(2+)的转化率高于90%.与之相似,当Ag镀液中的Ag~+含量等于0.5～2μm的Ag膜层所需量时,在333K化学镀120min后,Ag~+的转化率可达95%.Ag~+的高转化率与Ag颗粒的择向生长特性有关.根据Pd和Ag的化学镀沉积规律,通过调节镀液中金属离子的含量能够预先设计和精确控制超薄Pd/Ag膜的膜厚和组成.
The deposition rules of Pd were investigated during eleetroless plating in baths with different amounts of Pd~(2+).It was demonstrated that the Pd deposition rate was controlled by the auto-catalytic activity of the metal layer surface when the deposited Pd layer became thicker than 5 μm even if Pd~(2+) in the plating baths was far from being consumed.When me Pd~(2+) amount in the bath Was kept lower than that necessary for reaching the Pd layer thickness(e.g.corresponding to 1--4μm Pd),the Pd~(2+) conversion in the bath Was higher than 90% after reaction for 180 min.Furthermore,the same Was found during Ag deposition from silver plating baths with a low amount of Ag~+,i.e.Ag~+conversion was higher than 95% after plating for 120 min in baths containing Ag~+ sufficient for thick Ag layer of 0.5-2μm.It was proved by scanning electron microscopy measurements that the higher conversions of Ag~+ were related to the special growth properties of Ag particles.According to the deposition rules of Pd and Ag,the thickness and metal composition of ultra-thin Pd/Ag membranes prepared by laye-by-layer electroless plating could be pre-designed as well as accurately controlled by preparing relevant plating bath with low amounts ofmetal.
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