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The influence of H3BO3 on the zinc electroplating was studied using electrochemical noise technique, cyclic voltammetry and steady-state polarization method. The results showed that,under the experimental conditions, the deposition of zinc followed the mechanism of two-dimensional nucleation and subsequent grain growth. The addition of H3BO3 into the electroplating solution prominently changes the nucleation and growth kinetics of zinc deposits, which is directly related to the features of electrocrystallization noise and the corresponding structure of the elec.trodeposits. The results also shown that the electrochemical noise (EN) technique can give more information about the electrodeposits structure and electroplating mechanism than other normal electrochemical measurements can give, such as steady-state polarization method and cyclic voltammetry technique.

参考文献

[1] T Okada .[J].Journal of Electroanalytical Chemistry,1991,297:349.
[2] J Q Zhang;Z Zhang;J M Wang;C.N.Cao .[J].Journal Chinese Soc For Corrosion and Protection,2002,22(04):241.
[3] J Q Zhang;Z Zhang;J M Wang;C.N.Cao .[J].Journal Chinese Soc For Corrosion and Protection,2001,21(05):310.
[4] G Blanc;C Gabrielli;M Keddam .[J].Electrochimica Acta,1975,20:687.
[5] C Duchanoy;F Lapicque;C F Oduoza;A.A.Wragg .[J].Electrochimica Acta,2002,46:433.
[6] S Leopoid;M Herranen;J O Carisson .[J].Journal of the Electrochemical Society,2001,148:C513.
[7] E Budevski;W Obretenov;W Bostanov;G.Staikov .[J].Electrochimica Acta,1989,34:1023.
[8] V Bostanov;W Obretenov;G Staikov;D.K.Roe, E.Budevski .[J].Journal of Crystal Growth,1981,52:761.
[9] G Blanc;C Gabrielli;M Ksouri;R.Wiart .[J].Electrochimica Acta,1978,23:337.
[10] C Gabrielli;M Ksouri;R Wiart .[J].Journal of Electroanalytical Chemistry,1978,86:233.
[11] E Budewski;W Bostanoff;T Witanoff;Z.Stoinoff, A.Kotzewa R.Kaischew .[J].Electrochimica Acta,1966,11:1697.
[12] E Budevski;M Fleischmann;C Gabrielli;M.Labram .[J].Electrochimica Acta,1983,28:925.
[13] C Cachet;C Gabrielli;F Huet;M.Keddam R.Wiart .[J].Electrochimica Acta,1983,28:899.
[14] Z.Zhang;S.W.Deng;Q.Y.Cai;J.F.Li, F.H.Cao, Y.L.Cheng, J.Q.Zhang C.N.Cao.[J].Bulletin of Electrochemistry,2004
[15] M Monev;Ts Dobrev .[J].Metal Finishing,1992,10:50.
[16] T Grechev;M Cretkovska;T Stafilov;J.M.Schultze .[J].Electrochimica Acta,1991,36:1315.
[17] B S Sheshadri;S M Mayanna .[J].Electrodeposition and Surface Treatment,1975,3:189.
[18] C·K·Liou.Inorganic Chemistry[M].CSUT Press; Changsha,1994:114.
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