根据实际工业工艺流程和服役工况,制备接近真实服役状态下的微电子封装中无铅焊点界面化合物试样；采用扫描电镜(SEM)和能量色散X射线荧光光谱仪(EDX)确定IMC的形貌厚度和化学成分；根据W.C.Olive算法,利用连续刚度测量(CSM)技术,实现了IMC层、焊料和Cu的弹性模量、硬度随压痕深度变化的连续测量,得到IMC层材料的硬度和弹性模量分别为(5.2±0.2)GPa和(104.51±2.62)GPa.根据纳米压痕结果,焊料、Cu和IMC蠕变应力指数从小到大分别为15.129、61.463和70.27.
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