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  4. 铜包铝复合材料研究进展

中国有色金属学报, 2014, (5): 1275-1284.

铜包铝复合材料研究进展

张建宇 1, , 姚金金 2, , 曾祥勇 3, , 韩艳秋 4, , 吴春京 5,

1.北京科技大学 材料科学与工程学院，北京 100083; 河北工程大学 机电学院，邯郸 056038

2.北京科技大学 材料科学与工程学院,北京,100083

3.北京科技大学 材料科学与工程学院,北京,100083

4.北京科技大学 材料科学与工程学院,北京,100083

5.北京科技大学 材料科学与工程学院,北京,100083

基金项目:   国家自然科学基金资助项目(51274038)  

关键词： 铜包铝 , 复合材料 , 结合机理 , 界面反应

Research progress of copper cladding aluminum composites

Keywords： copper cladding aluminum , composite , bonding mechanism , interfacial reaction

对铜包铝复合材料及其相关领域的研究现状进行评述。介绍铜包铝复合材料的主要制备方法、铜铝的界面结合机理、铜铝二元合金相图、金属间化合物相的形成与长大规律等方面的研究成果，并对铜包铝复合材料的发展进行展望。

The recent progress in the researches on copper cladding aluminum bimetallic composites and related research fields was reviewed. The review mainly includes the fabrication of copper cladding aluminum bimetallic composites, the bonding mechanism of Cu/Al interface, the Cu-Al binary alloy phase diagram, and the formation and growth rule of intermetallic compounds. Finally, the development trend was proposed.

参考文献

[1] GIBSON A .The economics of copper clad aluminum bimetallic cables[J].Wire&Cable Technology International,2005,33(04):82-83.
[2] Wayne Perrard .Strategies for optimizing cable design and performance through the use of bimetallic wire[J].Wire Journal International,2001(7):154-159.
[3] QIAN Yi-yu,DONG Zhan-gui,MA Xin.Penetrating behavior of eutectic liquid during
[4] LY. Sheng;F. Yang;T.F. Xi;C. Lai;H.Q, Ye .Influence of heat treatment on interface of Cu/Al bimetal composite fabricated by cold rolling[J].Composites, Part B. Engineering,2011(6):1468-1473.
[5] T.G.Huang;Z.C.Lin .Hot rolling of an aluminum-copper sandwich flat strip with the three-dimensional finite element method[J].Journal of Materials Processing Technology,2000(s1-3):154-168.
[6] Li, X.;Zu, G.;Ding, M.;Mu, Y.;Wang, P..Interfacial microstructure and mechanical properties of Cu/Al clad sheet fabricated by asymmetrical roll bonding and annealing[J].Materials Science & Engineering, A. Structural Materials: Properties, Misrostructure and Processing,2011:485-491.
[7] K.Y. Rhee;W.Y. Han;H.J. Park .Fabrication of aluminum/copper clad composite using hot hydrostatic extrusion process and its material characteristics[J].Materials Science & Engineering, A. Structural Materials: Properties, Misrostructure and Processing,2004(1/2):70-76.
[8] H. C. Kwon;T. K. Jung;S. C. Lim .Fabrication of Copper Clad Aluminum Wire(CCAW) by Indirect Extrusion and Drawing[J].Materials Science Forum,2004(Pt.1):317-320.
[9] M. Zebardast;A. Karimi Taheri .The cold welding of copper to aluminum using equal channel angular extrusion (ECAE) process[J].Journal of Materials Processing Technology,2011(6):1034-1043.
[10] 戴玉梅,马永庆,吴云忠.室温包覆拉拔铜包铝线双金属接合的微观分析[J].材料热处理学报,2012(03):35-39.
[11] 吴云忠,马永庆,张洋,刘世永.铜包铝线材室温拉变形后的显微组织和力学性能[J].中国有色金属学报,2006(12):2066-2070.
[12] MAMALIS A G;VAXEVANIDIS N M;SZALAY A;PROHASZKA J .Fabrication of aluminum/copper bimetallics by explosive cladding and rolling[J].Journal of Materials Processing Technology,1994,44:99-117.
[13] S. Berski;H. Dyja;A. Maranda .Analysis of quality of bimetallic rod after extrusion process[J].Journal of Materials Processing Technology,2006(1/3):582-586.
[14] 吴运忠 .制造铜包铝排的生产方法[P].中国专利,200710011271.7,2007-05-09.
[15] LUO Jun-ting,ZHAO Shuang-jing,ZHANG Chun-xiang.Microstructure of aluminum/copper clad composite fabricated by casting-cold extrusion forming[J].中南大学学报(英文版),2011(04):1013-1017.
[16] 廖文俊,刘新宽,王宇鑫.高性能铜/铝复合排的制备及界面机理[J].同济大学学报（自然科学版）,2012(08):1234-1238.
[17] 谢建新;吴春京;周成;王自东 .一种包覆材料一次铸造连续成形设备与工艺[P].中国专利,ZL01109076,2003-09-03.
[18] 谢建新;刘新华;刘雪峰;苏亚军 .一种包覆材料水平连铸直接复合成形设备与工艺[P].中国专刊,200610112817.3,2008-04-02.
[19] Jianxin XIE;Chunjing WU;Xuefeng LIU;Xinhua LIU .A NOVEL FORMING PROCESS OF COPPER CLADDING ALUMINUM COMPOSITE MATERIALS WITH CORE-FILLING CONTINUOUS CASTING[J].Materials Science Forum,2007(1):956-961.
[20] 薛志勇,秦延庆,吴春京.铜包铝复合棒充芯连铸设备的开发[J].北京科技大学学报,2005(06):706-709.
[21] LIANG He;XUE Zhi-yong;WU Chun-jing;LIU Qing WU Yuan .Research on continuous core-filling casting forming process of copper-clad aluminum bimetal composite material[J].Acta Metall Sin:Engl Lett,2010,23(03):206-214.
[22] 臧勃林,赵永龙,梁贺,吴春京.铜包铝气压连铸成形工艺[J].特种铸造及有色合金,2011(05):447-449.
[23] SU Ya-jun;LIU Xin-hua;HUANG Hai-you;WU Chun-jing LIU Xue-feng XIE Jian-xin .Effects of processing parameters on the fabrication of copper cladding Aluminum rods by horizontal core-filling continuous casting[J].Metallurgical and Materials Transactions B:Process Metallurgy and Materials Processing Science,2011,42:104-113.
[24] 罗奕兵,刘新华,谢建新.铜包铝复合棒材平辊轧制宽展变形行为[J].中国有色金属学报,2009(11):1976-1981.
[25] 谢建新;刘新华;刘雪峰;罗奕兵 .一种高性能铜包铝矩形横断面复合导电母排及其制备工艺[P].中国专刊,200810057668.4,2008-02-04.
[26] 吴永福,刘新华,谢建新,王连忠,董晓文.矩形断面铜包铝复合材料的水平连铸直接复合成形[J].中国有色金属学报,2012(09):2500-2507.
[27] 吴永福,刘新华,谢建新.矩形断面铜包铝连铸坯轧制成形导电扁排的工艺及性能[J].北京科技大学学报,2012(11):1301-1307.
[28] 张建宇,王屹峰,万长清,曾祥勇,蔡鹏,吴春京.铜包铝复合扁排立式充芯连铸设备的研制[J].特种铸造及有色合金,2013(03):265-268.
[29] 张胜华;郭祖军 .铝/铜轧制复合板的界面结合机制[J].中南工业大学学报(自然科学版),1995,26(04):509-513.
[30] PENG X K;HENESS G;YEUNG W Y.Effects of sintering conditions on the bond strength of roll bonded metal laminate composites[A].Gold Coast,Australia,1997:119-125.
[31] PENG X K;HENESS G;YEUNG W Y .Effect of rolling temperature on interface and bond strength development of roll bonded copper/aluminum metal laminates[J].Journal of Materials Science,1999,34:277-281.
[32] PENG X K;WUHRER R;HENESS G;YEUNG W Y .Rolling strain effects on the interlaminar properties of roll bonded copper/aluminum metal laminates[J].Journal of Materials Science,2000,35:4357-4363.
[33] Chih-Yuan Chen;Hao-Long Chen;Weng-Sing Hwang .Influence of Interfacial Structure Development on the Fracture Mechanism and Bond Strength of Aluminum/Copper Bimetal Plate[J].Materials transactions,2006(4):1232-1239.
[34] M. Abbasi;A. Karimi Taheri;M.T. Salehi .Growth rate of intermetallic compounds in Al/Cu bimetal produced by cold roll welding process[J].Journal of Alloys and Compounds: An Interdisciplinary Journal of Materials Science and Solid-state Chemistry and Physics,2001(1/2):233-241.
[35] Hug, E.;Bellido, N. .Brittleness study of intermetallic (Cu, Al) layers in copper-clad aluminium thin wires[J].Materials Science & Engineering, A. Structural Materials: Properties, Misrostructure and Processing,2011(22):7103-7106.
[36] 吴永福,刘新华,谢建新.连铸直接成形矩形断面铜包铝复合材料界面及其在轧制中的变化[J].中国有色金属学报,2013(01):191-200.
[37] 苏亚军,刘新华,吴永福,黄海友,谢建新,王连忠,董晓文.水平连铸直接复合成形铜包铝复合材料的组织与性能[J].特种铸造及有色合金,2011(09):785-790.
[38] 张红安,陈刚.铜/铝复合材料的固-液复合法制备及其界面结合机理[J].中国有色金属学报,2008(03):414-420.
[39] MURRAY J L .The aluminum-copper system[J].International Metals Reviews,1985,30(05):211-233.
[40] GODECKE T;SOMMER F .Solidification behaviour of the Al2Cu Phase[J].ZEITSCHRIFT FUR METALLKUNDE,1996,87(07):581-586.
[41] Liu XJ.;Kainuma R.;Ishida K.;Ohnuma I. .Phase equilibria in the Cu-rich portion of the Cu-Al binary system[J].Journal of Alloys and Compounds: An Interdisciplinary Journal of Materials Science and Solid-state Chemistry and Physics,1998(1/2):201-208.
[42] RIANI P;ARRIGHI L;MARAZZA R;MAZZONE D ZANICCHI G FERRO R .Ternary rare-earth alumimum systems with copper:A review and a contribution to their assessment[J].Journal of Phase Equilibria and Diffusion,2004,25(01):22-52.
[43] Gulay LD.;Harbrecht B. .The crystal structure of zeta(2)-Al3Cu4-delta[J].Zeitschrift fur Anorganische und Allgemeine Chemie,2003(3):463-466.
[44] GULAY L D;HARBRECHT B .The Crystal structure ofζ1-Al3Cu4[J].Journal of Alloys and Compounds,2004,367:103-108.
[45] PONWEISER N;LENGAUER C L;RICHTER K W .Re-investigation of phase equilibria in the system Al-Cu and structural analysis of the high-temperature phase η1-Al1-δCu[J].INTERMETALLICS,2011,19:1737-1746.
[46] KISI E H;BROWNE J D .Ordering and structural vacancies in non-stoichiometric Cu-Al γ brasses[J].Acta Crystallographica Section B,1991,47(06):835-843.
[47] KOUTERS M H M;GUBBELS G H M;YUAN C A.Characterization of intermetallic compounds in Cu-Al ball bonds:mechanical properties,delamination strength and thermal conductivity[A].Lisbon,Portugal Eurosime,2012:1-9.
[48] BRAUNOVIC M;ALEKSANDROV N.Intermetallic compounds at aluminum-to-copper and copper-to-tin electrical interfaces[A].Philadelphia,USA,1992:25-34.
[49] BRAUNOVIC M;RODRIGUE L;GAGNON D.Nanoindentation study of intermetallic phases in Al-Cu bimetallic system[A].Orlando,FL,USA,2008:270-275.
[50] 余永宁.材料科学基础[M].北京:高等教育出版社,2012:523-524.
[51] FUNAMIZU Y;WATANABE K .Interdiffusion in the Al-Cu system[J].Transactions of the Japan Institute of Metals,1971,12:147-152.
[52] TAN Y Y;YONG F K.Cu-Al IMC micro structure study in Cu Wire bonding with TEM[A].Singapore,2010:1-4.
[53] PENG X K;WUHRER R;HENESS G;YEUNG W Y .On the interface development and fracture behavior of roll bonded copper/aluminum metal laminates[J].Journal of Materials Science,1999,34:2029-2038.
[54] Heness G;Wuhrer R;Yeung WY .Interfacial strength development of roll-bonded aluminium/copper metal laminates[J].Materials Science & Engineering, A. Structural Materials: Properties, Misrostructure and Processing,2008(0):740-742.
[55] Chih-Yuan Chen;Weng-Sing Hwang .Effect of Annealing on the Interfacial Structure of Aluminum-Copper Joints[J].Materials transactions,2007(7):1938-1947.
[56] PRETORIUS R;MARAIS T K;THERON C C .Thin film compound phase formation sequence:An effective heat of formation model[J].Material Science and Engineering,1993,10:1-83.
[57] Guo, Y.;Liu, G.;Jin, H.;Shi, Z.;Qiao, G. .Intermetallic phase formation in diffusion-bonded Cu/Al laminates[J].Journal of Materials Science,2011(8):2467-2473.
[58] Chih-Chun Hsieh;Ming-Shou Shi;Weite Wu .Growth of Intermetallic Phases in Al/Cu Composites at Various Annealing Temperatures During the ARB Process[J].Metals and Materials International,2012(1):1-6.
[59] XU B;TONG W P;LIU C Z;ZHANG H ZUO L HE J C .Effect of high magnetic field on growth behavior of compound layers during reactive diffusion between solid Cu and liquid Al[J].Journal of Materials Science and Technology,2011,27(09):856-860.
[60] Braunovic M.;Alexandrov N. .Intermetallic compounds at aluminum-to-copper electrical interfaces: effect of temperature and electric current[J].IEEE Transactions on Components, Packaging, and Manufacturing Technology. Part A,1994(1):78-85.
[61] Won-Bae Lee;Kuek-Saeng Bang;Seung-Boo Jung .Effects of intermetallic compound on the electrical and mechanical properties of friction welded Cu/Al bimetallic joints during annealing[J].Journal of Alloys and Compounds: An Interdisciplinary Journal of Materials Science and Solid-state Chemistry and Physics,2005(1/2):212-219.
[62] Meguro, K.;O, M.;Kajihara, M. .Growth behavior of compounds due to solid-state reactive diffusion between Cu and Al[J].Journal of Materials Science,2012(12):4955-4964.
[63] Y. Tanaka;M. Kajihara;Y. Watanabe .Growth behavior of compound layers during reactive diffusion between solid Cu and liquid Al[J].Materials Science & Engineering, A. Structural Materials: Properties, Misrostructure and Processing,2007(0):355-363.
[64] KAWAKAMI H;SUZUKI J;FUJIWARA M;JUNNA N .Effect of bonding conditions on Al/Cu Dissimilar bonding with liquefaction by reaction diffusion in air (in Japanese)[J].Quarterly Journal of the Japan Welding Society,2007,25(01):24-30.
[65] LI Dong-gang;LIU Tie;LI Guo-jian;WANG Qiang HE Ji-cheng .Growth of diffusion layers at liquid Al-solid Cu interface under uniform and gradient high magnetic field conditions[J].Materials Chemistry and Physics,2009,117:504-510.
[66] KAWAKAMI H;NAKAJIMA J;SUZUKI J .Bonding process of Al/Cu bonding with liquefaction after solid state diffusion in air[J].Welding International,2007,21(12):836-843.
[67] MERENO J;GARRETT J;EMBURY D .A technique rapid characterization of intermetallics and interfaces[J].INTERMETALLICS,1999,7:1001-1009.
[68] YA-JUN SU;XIN-HUA LIU;HAI-YOU HUANG .Interfacial Microstructure and Bonding Strength of Copper Cladding Aluminum Rods Fabricated by Horizontal Core-Filling Continuous Casting[J].Metallurgical and Materials Transactions, A. Physical Metallurgy and Materials Science,2011(13):4088-4099.
[69] Y. Tanaka;M. Kajihara .Numerical analysis for migration of interface between liquid and solid phases during reactive diffusion in the binary Cu-Al system[J].Materials Science & Engineering, A. Structural Materials: Properties, Misrostructure and Processing,2007(1/2):101-110.
[70] Yasuhiko Tanaka;Masanori Kajihara .Evaluation of Interdiffusion in Liquid Phase during Reactive Diffusion between Cu and Al[J].Materials transactions,2006(10):2480-2488.
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