采用常温硫酸镍电镀溶液研究了不同阴极电流和不同电镀时间对P型Bi_2Te_3基热电材料电镀镍层的显微结构和结合性能的影响.对镍层的形貌、厚度、成分以及与Bi_2Te_3基体之间的接触电阻进行了表征.研究结果表明在选定实验条件下,电流密度为1.0A/dm~2,沉积时间为6分钟时界面电阻为最小值1.804Ω.
The microstructures and binding properties of nickel films electro-plated on P-type Bi_2Te_3 based thermoelectric materials under different cathode currents and different plating time were studied. The morphology, the thickness and the composition of the nickel films, and the interface resistance between nickel film and P-type Bi_2Te_3 base were characterized. The results show that on the selected experimental conditions, the minimum interface resistance value is 1. 804Ω when the current density is 1.0A/dm~2 and the deposition time is 6 minutes.
参考文献
| [1] | 侯贤华,胡社军,汝强,赵灵智,余洪文,李伟善.Bi2Te3基热电材料的研究现状及发展[J].材料导报,2007(07):111-114,118. |
上一张
下一张
上一张
下一张
计量
- 下载量()
- 访问量()
文章评分
- 您的评分：
-
10%
-
20%
-
30%
-
40%
-
50%