采用交流阻抗法和恒电位阶跃法研究了在硼砂缓冲溶 液（pH9.2）中BTA及其系列衍生物CBTME，CBTBE对Cu电极的缓蚀行为.结果表明：BTA对Cu 的缓蚀作用是由于在Cu表面上生成了Cu/Cu2O/Cu(I)BTA膜，阻滞了Cu的腐蚀，而且缓蚀剂 的浓度越高，生成的Cu/Cu2O/Cu(I)BTA膜越致密，抑制作用越强.含CBTME缓蚀剂的溶液 中，缓蚀效果随缓蚀剂浓度的升高而增强，但同浓度比较时，BTA的缓蚀效果优于CBTME.当 溶液中含有较低浓度CBTBE时，缓蚀剂促进Cu的腐蚀；而当溶液中含有较高浓度CBTBE时，缓 蚀剂才抑制Cu的腐蚀.一定比例的BTA和CBTME复配后对Cu的缓蚀作用有协同效应.以5 mg/L 为缓蚀剂总量，其最佳复配方案为2 mg/L BTA+3 mg/L CBTME.恒电位阶跃法测得的结果与 交流阻抗方法测得的结果相符.
The corrosion inhibition of BTA series inhibitors on copper was studied using AC impedance technique and potential step technique. T he results indicate that the corrosion of Cu is inhibited due to Cu/Cu2O/Cu(I) BTA film formed on the surface of Cu. The higher is the inhibitor concentration, the more compact the Cu/Cu2O/Cu(I)BTA film produces. The corrosion rate of Cu decreases with the increasing concentration of CBTME. However, compared at the same concentration, BTA shows the better inhibiting action than CBTME. The c orrosion rate of Cu increased, when Cu electrodes immersed in the solution w ith low concentration of CBTBE and the corrosion rate of Cu decreased when Cu el ectrodes immersed in the solution with high concentration of CBTBE. A combinatio n of BT A and CBTME exhibits a synergistic effect, and the optimum ratio with 5 mg/L inh ibitor is 2 mg/L BTA+3 mg/L CBTME. The results from potential step technique are in agreement with those from AC impedance technique.
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