在水体系中利用直流电沉积的方法以IrC13为主盐在铂基体上制备出了Ir层.利用SEM、EDS和XPS对不同工艺参数下所制备Ir层的表面形貌及成分进行了分析,并最终获得了最优的电沉积工艺条件.结果表明:IrCl3主盐浓度对Ir层形貌有较大影响,浓度太低时电沉积的铱层太薄,导致铱层易起皮或产生裂纹,故适当提高主盐的浓度有利于改善Ir层质量:在一定的pH值范围内,电沉积所制备的lr层表面形貌差别不大,表面均比较平整,Ir颗粒比较均匀、致密;电流密度对Ir层表面形貌尤其是对Ir层结晶颗粒的大小和致密性影响较大;电沉积溶液的温度太低时,不能沉积出Ir层,温度太高时,则沉积出的Ir层粗糙、表面形貌不均匀.
Iridium layer was prepared on platinum substrate under constant current in aqueous system using anhydrous iridium chloride as precursors.The surface morphology and the composition of the iridium layer were characterized by SEM,EDS and XPS.The optimized condition was derived.The results show that the concentration of iridium chloride has great influence on the surface morphology of the iridium layer.When the concentration is low,too thin iridium layer is formed,resulting in peeling or cracking.Therefore,an appropriate increase in the concentration of the precursors will help to improve the quatity of the lr layer.In a certain range of pH values,the surface morphologies of the iridium layers prepared on different conditions are nearly the same.The surface is smooth and iridium particles ate uniform and dense.Current density has great influence on the surface morphology of the iridium layer,especially on the size and the density of crystalline particle.The iridium layer cannot be deposited at low solution temperature.Whereas the iridium layer is rough and its surface morphology is uneven at too high temperature.
参考文献
| [1] | 闫鑫;张秋禹.[J].宇航材料工艺,2003(02):1. |
| [2] | 胡昌义,李靖华.化学气相沉积技术与材料制备云南省应用基础研究基金[J].稀有金属,2001(05):364-368. |
| [3] | 胡昌义;李靖华;王云 .[J].贵金属,2002,54:33. |
| [4] | 华云峰,陈照峰,张立同,成来飞.MOCVD Ir薄膜的制备与沉积效果分析[J].稀有金属材料与工程,2005(01):139-142. |
| [5] | Mumtaz K.;Enoki H.;Hirai T.;Shindo Y.;Echigoya J. .THERMAL CYCLING OF IRIDIUM COATINGS ON ISOTROPIC GRAPHITE[J].Journal of Materials Science,1995(2):465-472. |
| [6] | Toenshoff D A.[A].Huntsville:Von Braun Civic Center,2000:1. |
| [7] | 闫鑫;张秋禹 .[J].稀有金属,2004,28(04):756. |
| [8] | 王丽丽.电镀铱和铱-铂合金[J].电镀与精饰,2000(02):19-21. |
| [9] | 唐勇;杜继红;李争显 .[J].稀有金属材料与工程,2008,37(z4):610. |
| [10] | Takashi Ohsaka;Motohiro Isaka;Katsuhiko Hirano .[J].Ultrasonics Sonochemistry,2008,15:283. |
| [11] | 张景双;石金声;石磊.电镀溶液与镀层性能测试[M].北京:化学工业出版社,2003:19. |
| [12] | 张锦秋,安茂忠,常立民,刘桂媛.主盐浓度和工艺条件对Sn-Ag-Cu合金镀层组成和形貌的影响[J].无机化学学报,2008(07):1056-1061. |
| [13] | 安茂忠.电镀理论与技术[M].哈尔滨:哈尔滨工业大学出版社,2001:60. |
- 下载量()
- 访问量()
- 您的评分：
-
10%
-
20%
-
30%
-
40%
-
50%