用三维元胞自动机法(CA法)模拟纯铜在400℃以0.0005s~(-1)的应变率发生动态再结晶(DRX)的过程.给出了母相和再结晶晶粒的平均位错密度随着应变量的变化规律;根据平均位错密度的变化研究了纯铜动态再结晶中形核、长大、动态回复和加工硬化等过程.模拟了纯铜动态再结晶过程中的应力.应变曲线及平均晶粒尺寸的变化规律,模拟结果与文献中的试验结果吻合较好.
A modeling of 3-dimensional cellular automaton (CA) method was developed to simulate the dynamic recrystallization(DRX) of pure copper at 400℃ with constant strain rate 0.0005s~(-1) . Mean dislocation density was used to describe the process of nucleation, growth, work harding and dynamic recovery during dynamic recrystallization. The flow stress was calculated by the mean dislocation. Stress-strain curves and changes of the average grain size during DRX of pure copper were simulated. Simulated results agree well with the experimental result in literature.
参考文献
| [1] | Rollett A D;Luton M J;Srolovize D J .Microstructural simulation of dynamic recrystallization[J].Ada Metal Mater,1992,40(0:43-55. |
| [2] | 张继祥,关小军,孙胜.一种改进的晶粒长大Monte Carlo模拟方法[J].金属学报,2004(05):457-461. |
| [3] | 朱鸣芳,陈晋,孙国雄,洪俊杓.枝晶生长的数值模拟[J].金属学报,2005(06):583-587. |
| [4] | Hesselbarth H W;Gobel I R .Simulation of recrystallization by cellular automata[J].Acta Metallurgica,1991,39(09):2135-2143. |
| [5] | Davies C H J .The effect of neighborhood on the kinetics of a cellular-automaton recrystallization model[J].Scripta Metallurgica,1995,33(07):1139-1143. |
| [6] | Goetz R L;Seetharaman V .Static recrystallization kinetics with homogeneous and heterogeneous nucleation using a cellular automata model[J].Metallurgical and Materials Transactions,1998,29(09):2307-2321. |
| [7] | Raabe D .Introduction of a scalable three-dimensional cellular automaton with a probabilistic switching rule for the discrete mesoscale simulation of recrystallization phenomena[J].Philosophical Magazine A:Physics of Condensed Matter:Structure,Defects and Mechanical Properties,1999,79(10):2339-2358. |
| [8] | Blaz L;Sakai T;Jonas J J .Effect of initial grain-size on dynamic recrystallization of copper[J].Metal Science Journal,1983,17(12):609-616. |
| [9] | Prasad YVRK;Rao KP .Processing maps and rate controlling mechanisms of hot deformation of electrolytic tough pitch copper in the temperature range 300-950 degrees C[J].Materials Science & Engineering, A. Structural Materials: Properties, Misrostructure and Processing,2005(1/2):141-150. |
| [10] | Roberts W;Ahlblom B .Nucleation criterion for dynamic recrystallization during hot working[J].Acta Metallurgica,1978,26(05):801-813. |
| [11] | Mecking H;Kocks U F .Kinetics of flow and stain-hardening[J].Acta Metallurgica,1981,29(11):1865-1875. |
| [12] | 何燕,张立文,牛静,裴继斌.元胞自动机方法对动态再结晶过程的模拟[J].材料热处理学报,2005(04):120-124. |
| [13] | 卢瑜,张立文,邓小虎,裴继斌,王赛,张国梁.纯铜动态再结晶过程的元胞自动机模拟[J].金属学报,2008(03):292-296. |
| [14] | 麻晓飞,关小军,刘运腾,申孝民,王丽君,宋述同,曾庆凯.基于改进转变规则的晶粒长大CA模型[J].中国有色金属学报,2008(01):138-144. |
| [15] | R. DING;Z. X. GUO .COUPLED QUANTITATIVE SIMULATION OF MICROSTRUCTURAL EVOLUTION AND PLASTIC FLOW DURING DYNAMIC RECRYSTALLIZATION[J].Acta materialia,2001(16):3163-3175. |
| [16] | G. Kugler;R. Turk .Modeling the dynamic recrystallization under multi-stage hot deformation[J].Acta materialia,2004(15):4659-4668. |
| [17] | A. MANONUKUL;F. P. E. DUNNE .INITIATION OF DYNAMIC RECRYSTALLIZATION UNDER INHOMOGENEOUS STRESS STATES IN PURE COPPER[J].Acta materialia,1999(17):4339-4354. |
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