随着集成电路的飞速发展,半导体器件特征尺寸按摩尔定律不断缩小.SiO2栅介质将无法满足Metal-oxide-semniconductor field-effect transistor(MOSFET)器件高集成度的需求.因此,应用于新一代MOSFET的高介电常数(k)栅介质材料成为微电子材料研究热点.介绍了不断变薄的SiO2栅介质层带来的问题、对MOSFET栅介质材料的要求、制备高k薄膜的主要方法,总结了高k材料的研究现状及有待解决的问题.
参考文献
[1] | [OL].http://www.linuxforums.org/forum/coffee-lounge/29841-whatever-happened-moores-law.html |
[2] | Lo S.-H.;Buchanan D.A. .Quantum-mechanical modeling of electron tunneling current from the inversion layer of ultra-thin-oxide nMOSFET's[J].IEEE Electron Device Letters,1997(5):209-211. |
[3] | Liao CC.;Tsai C.;Chin A. .Electrical characterization of Al2O3 on Si from thermally oxidized AlAs and Al[J].Journal of Crystal Growth,1999(0):652-655. |
[4] | Wilk GD.;Anthony JM.;Wallace RM. .High-kappa gate dielectrics: Current status and materials properties considerations [Review][J].Journal of Applied Physics,2001(10):5243-5275. |
[5] | Angus L K;Jon P M;Streiffer S K .Alterative dieletrics to silicon didoxide for menory and logic devices[J].Nature,2000,406:1032. |
[6] | 周华杰,徐秋霞.下一代栅材料-难熔金属[J].电子器件,2007(02):398-402. |
[7] | 钟兴华,徐秋霞.超薄Si3N4/SiO2叠层栅介质可靠性研究[J].电子器件,2007(02):361-364. |
[8] | 门传玲,徐政,郑志宏,多新中,张苗,林成鲁.离子束增强沉积AlN薄膜的研究[J].压电与声光,2001(05):366-369. |
[9] | Xin Guo;T. P. Ma .Tunneling leakage current in oxynitride: dependence on oxygen/nitrogen content[J].IEEE Electron Device Letters,1998(6):207-209. |
[10] | Albertin K F;Pereyra I;Alayo M I .MOS capacitors with PECVD SiOxNy insulating layer[J].Materials Characterization,2003,50(2-3):149. |
[11] | 郭得峰,耿伟刚,兰伟,黄春明,王印月.Y掺杂Al2O3高k栅介质薄膜的制备及性能研究[J].物理学报,2005(12):5901-5906. |
[12] | Huang Y L;Chang P;Yang Z K et al.Thermodynamic stability of Ga2O3(Ga2O3)/GaAs interface[J].Applied Physics Letters,2005,86(19):191905. |
[13] | Sun S.C.;Chen T.F. .Reduction of leakage current in chemical-vapor-deposited Ta/sub 2/O/sub 5/ thin films by furnace N/sub 2/O annealing[J].IEEE Transactions on Electron Devices,1997(6):1027-1029. |
[14] | Atanassova E;Spassov D;Paskaleva A .Effect of the metal gate on the breakdown characteristics and leakage current of Ta2O5 stack capacitors[J].Journal of optoelectronics and advanced materials,2007(2):315-318. |
[15] | 徐文彬 .高k电介质薄膜制备研究与集成薄膜电容探讨[D].浙江大学,2008. |
[16] | 章宁琳,宋志棠,沈勤我,林成鲁.新型高K栅介质ZrO2薄膜材料的制备及表征[J].功能材料与器件学报,2003(01):75-78. |
[17] | Chang Y C;Chiu H C;Lee Y J et al.Structural and electrical characteristics of atomic layer deposited high k HfO2 on GaN[J].Applied Physics Letters,2007,90(23):232904. |
[18] | Lal H B;Caur K .Electrical-conduction in non-metallic rare-earth solids[J].Journal of Materials Science,1988,23:919. |
[19] | KuoD H;Chen W R .Growth and properties of amorphous thin films of the Al2O3/Y2O3 system[J].Thin Solid Films,2006,497:65. |
[20] | Kuniyuki Kakushima;Kazuo T;Sun-Ichiro O et al.Rare earth oxides in microelectronics[J].Topics in Applied Physics,2007,106:345. |
[21] | Fang Z B;Chen S;Zhu Y Y et al.Structural and electrical characterization of uhrathin Er2O3 films grown on Si by reactive evaporation[J].Nanotechnology,2007,18:155205. |
[22] | Y. Y. Zhu;Z. B. Fang;S. Chen;C. Liao;Y. Q. Wu;Y. L. Fan;Z. M. Jiang .Fowler-Nordheim hole tunneling in metal-Er_(2)O_(3)-silicon structures[J].Applied physics letters,2007(12):122914-1-122914-3-0. |
[23] | Jeon S;Yang H;Park D G et al.Electrical and structural properties of nanolaminate(Al2O3/ZrO2/Al2O3)for metal oxide semiconductor gate dielectric applications[J].Japan J Appl Phys Part 1-Regular Papers short Notes &Review Papers,2002,41(4B):2390. |
[24] | 冯丽萍,刘正堂.射频磁控溅射法制备HfSiON高k薄膜的结构特性[J].材料开发与应用,2008(02):5-7,17. |
[25] | Pan Tungming;Shu Weihao;Hong Jialiang .Structural and electrical charateristics of Er2TiO5 gate dielectrics[J].Applied Physics Letters,2007,90(22):222906. |
[26] | Edon V;Hugon MC;Agius B;Cohen C;Cardinaud C;Eypert C .Structural and electrical properties of the interfacial layer in sputter deposited LaAlO3/Si thin films[J].Thin Solid Films: An International Journal on the Science and Technology of Thin and Thick Films,2007(20/21):7782-7789. |
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