通过电化学方法研究甲基磺酸体系中电沉积得到的纯Pb、Pb-Sn(0.6％)和Pb-Sn(0.6％)-Sb(0.6％)(均为质量分数)合金阳极在CuSO4-H2SO4体系下的电化学性能,结果表明新型的Pb-Sn(0.6％)-Sb(0.6％)合金阳极电催化性能和耐蚀性能均比Pb-Sn(0.6％)和纯Pb阳极优异.采用扫描电子显微镜观察了3种合金材料极化24 h后的表面形貌,图像显示纯Pb表面疏松多孔,大部分区域出现了裂纹,Pb-Sn(0.6％)和Pb-Sn(0.6％)-Sb(0.6％)合金阳极表面形貌比较均匀和致密.X射线衍射表明,Pb-Sn(0.6％)和Pb-Sn(0.6％)-Sb(0.6％)合金材料对应的PbO2和PbO的衍射峰比纯Pb强,且Pb-Sn(0.6％)-Sb(0.6％)阳极材料PbO2的衍射峰最强,说明Pb-Sn(0.6％)-Sb(0.6％)阳极的导电性最好.
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