导电胶是一种非常重要的无铅连接材料。介绍了导电胶的组成及分类，概括了几种典型的导电胶导电机理，阐述了近年来提高导电胶综合性能的悁究进展，展望了导电胶的未来发展形势。
As an important lead-free interconnect material, conductive adhesives have attracted a widespread attention in the world. The classification and composition of conductive adhesives were simply introduced, several conductive mechanisms of conductive adhesives were summarized, and several means to improve the comprehensive properties of conductive adhesives were emphasized. The future development of conductive adhesives was prospected.
参考文献
| [1] | 谢明贵,郭丹,黄艳,卢志云.无铅电子组装材料--导电胶的研究进展[J].精细化工,2008(11):1061-1065. |
| [2] | Hwang J.Implementing Lead-free Electronics[M].McGraw-Hill Professional,2004:4-10. |
| [3] | Electronics Without Lead[J].Science,2005(5727):1419-1420. |
| [4] | Li Y;Wong CP .Recent advances of conductive adhesives as a lead-free alternative in electronic packaging: Materials, processing, reliability and applications[J].Materials Science & Engineering, R. Reports: A Review Journal,2006(1/3):1-35. |
| [5] | Nguyen G P;Williams J R;Gibson F W.Electrical reliability of conductive adhesive for surface-mount applications[A].Dallas,TX,USA:Int Soc for Hybrid Microelectronics,1993:9-11. |
| [6] | Ling Wang;Chao Wan;Hongqin Wang.Electrical property improvement of dicyandiamide-cured electrically conductive adhesives through in-situ replacement by difunctional acids and the impact on storage[J].International Journal of Adhesion & Adhesives,2013:132-137. |
| [7] | Gilleo K .Assembly with conductive adhesives[J].SOLDERING & SURFACE MOUNT TECHNOLOGY,1995,7(1):12-17. |
| [8] | 周静,孙海滨,郑昕,刘俊成.粒子填充型导电复合材料的导电机理[J].陶瓷学报,2009(03):281-285. |
| [9] | Ezquerra T A;Kulescza M;Cruz C S et al.Charge transport in polyethylene-graphite composite materials[J].Advanced Materials,1990,2(12):597-600. |
| [10] | Van Beek L K H;Van Pul B .Internal field emission in carbon black-loaded natural rubber vulcanizates[J].Journal of Applied Polymer Science,1962,6(24):651-655. |
| [11] | 高玉,余云照.导电胶固化过程中导电网络形成的机理[J].粘接,2004(06):1-3. |
| [12] | 熊胜虎,杨荣春,吴丹菁,郑东风,田民波.银粉形貌与尺寸对导电胶电性能的影响[J].电子元件与材料,2005(08):14-16. |
| [13] | S. Khairul Anuar;M. Mariatti;A. Azizan;N. Chee Mang;W. T. Tham .Effect of different types of silver and epoxy systems on the properties of silver/epoxy conductive adhesives[J].Journal of Materials Science. Materials in Electronics,2011(7):757-764. |
| [14] | Li D;Cui H;Chen S et al.A highly conductive bimodal isotropic conductive adhesive and its reliability[J].ECS Transactions,2011,34(1):583-588. |
| [15] | F. Marcq;P. Demont;P. Monfraix;A. Peigney;Ch. Laurent;T. Falat;F. Courtade;T. Jamin .Carbon nanotubes and silver flakes filled epoxy resin for new hybrid conductive adhesives[J].Microelectronics and reliability,2011(7):1230-1234. |
| [16] | Dapeng Chen;Xueliang Qiao;Xiaolin Qiu;Fatang Tan;Jianguo Chen;Renzhi Jiang .Effect of silver nanostructures on the resistivity of electrically conductive adhesives composed of silver flakes[J].Journal of Materials Science. Materials in Electronics,2010(5):486-490. |
| [17] | 樊明娜,李世鸿,刘继松,黄富春.添加纳米银粉对导电胶体积电阻率的影响[J].贵金属,2014(02):10-13. |
| [18] | Shilong Chen;Konghua Liu;Yuanfang Luo.In situ preparation and sintering of silver nanoparticles for low-cost and highly reliable conductive adhesive[J].International Journal of Adhesion & Adhesives,2013:138-143. |
| [19] | HONGJIN JIANG;KYOUNG-SIK MOON;JIONGXIN LU;C.P.WONG .Conductivity Enhancement of Nano Silver-Filled Conductive Adhesives by Particle Surface Functionalization[J].Journal of Electronic Materials,2005(11):1432-1439. |
| [20] | 万超,王宏芹,王玲,杜彬,王鹏程,符永高.低熔点SnBi合金对导电银胶性能的影响[J].电子元件与材料,2011(03):55-57. |
| [21] | 李芝华,孙健.固化过程对导电胶体积电阻率的影响[J].高分子材料科学与工程,2010(08):80-82,86. |
| [22] | 银锐明,王刘功,杨华荣,刘飘,侯清麟,李静,陈琳璋.树脂基体对导电胶体积电阻率的影响[J].中南大学学报（自然科学版）,2013(02):526-531. |
| [23] | Yi Li;Kyoung-Sik Moon;C. P. Wong .Electrical Property Improvement of Electrically Conductive Adhesives Through In-Situ Replacement by Short-Chain Difunctional Acids[J].IEEE transactions on components and packaging technologies: A publication of the IEEE Components, Packaging, and Manufacturing Technology Society,2006(1):173-178. |
| [24] | 张中鲜,陈项艳,肖斐.微米银片的表面处理及其导电胶研究[J].复旦学报（自然科学版）,2010(05):587-591,597. |
| [25] | 李先学,郑炳云,许丽梅,吴丹丹,刘宗林,张惠钗.表面硅烷化纳米银粉导电胶性能研究[J].稀有金属材料与工程,2012(01):24-27. |
| [26] | 左新浪,夏志东,雷永平,史耀武.促进剂在导电胶中的作研究[J].中国胶粘剂,2009(12):10-12. |
| [27] | Daoqiang Lu;C. P. Wong .High Performance Conductive Adhesives[J].IEEE transactions on electronics packaging manufacturing: A publication of the IEEE Components, Packaging, and Manufacturing Technology Society,1999(4):324-330. |
| [28] | 张晓波,姜岩峰.新一代导电胶材料接触电阻稳定性研究[J].电子与封装,2006(10):5-9. |
| [29] | 阎睿,虞鑫海,刘万章.导电胶性能的影响因素与表征[J].化学与黏合,2012(02):71-73,83. |
| [30] | 高宏,刘岚,卢嘉圣,罗远芳,贾德民,刘孔华.原位置换法稳定导电胶接触电阻的研究[J].功能材料,2011(03):528-532,536. |
上一张
下一张
上一张
下一张
计量
- 下载量()
- 访问量()
文章评分
- 您的评分：
-
10%
-
20%
-
30%
-
40%
-
50%