研究了搅拌摩擦焊法搭接TA2工业纯钛和T2紫铜.工艺优化实验结果表明:Cu/Ti搭接搅拌摩擦焊工艺窗口较窄,在搅拌头转速800 r/min、焊速20 mm/min以及搅拌头转速900 r/min、焊接速度30 mm/min的焊接工艺参数配比条件下,可获得无缺陷且焊缝表面、搭接界面成形良好的Cu/Ti接头.对搅拌头转速800 r/min、焊速20 mrr/min的焊接参数下获得的Cu/Ti接头焊缝进行金相和SEM观察,分析结果表明:搭接界面两侧Cu、Ti宏观流动现象明显,Ti向Cu一侧的塑性材料流动量要明显优于Cu向Ti一侧,且在局部机械混合区呈典型的Cu/Ti相间条带状结构;在搭接界面处形成一层平均厚度约为4.8 μm的扩散过渡层,在过渡层中Cu的扩散速度要大于Ti的扩散速度,Cu/Ti搭接界面形成冶金结合.
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