将真空压铸(50％真空度)Al-Si-Cu合金试样在500℃固溶处理0.5、2、4和6h以及进行500℃×4h+530℃×6h的固溶处理,利用光学显微镜和扫描电镜研究了真空压铸对Al-Si-Cu合金固溶处理过程表面起泡的影响.结果表明:相对于普通压铸,真空压铸试样基体更致密、内部气孔小且分散,固溶处理过程中起泡核心长大需要较长时间,表面起泡小于100 μm的条件下,在500℃可固溶处理2h;起泡核心距离表面越远、核心尺寸越小以及表面致密度、强度越高,表面起泡所需要的时间也越长.
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