对TiC金属陶瓷和304不锈钢进行真空扩散连接实验,并采用Ti/Nb/Cu中间层以实现活性连接并缓解接头残余应力的目的.对焊后接头进行详细的组织分析和力学性能测试来评估焊接工艺.分析发现在TiC金属陶瓷和304不锈钢之间形成明显的转变过渡区,界面反应产物为(Ti,Nb)、剩余Nb、剩余Cu以及Cu (s.s).连接温度925℃,保温时间20 min,压力8 MPa下得到的接头剪切强度达84.6 MPa,此时脆性断裂发生在靠近界面处的陶瓷内部.结果表明,中间层Ti/Nb/Cu的合理选择能很好的降低金属间化合物对接头性能的有害作用,而且Nb对接头残余应力的改善起到关键作用,有效的提高了接头强度.
Vacuum diffusion bonding of TiC cermet/304 stainless steel (304SS) was conducted and Ti-Nb-Cu multi-interlayer was used to achieve active bonding and residual stress relieving.Detailed microstructure characterization and mechanical property assessment were carried out to evaluate the bonding technology.It is found that an obvious transition zone is formed at the interfaces,and the interracial products are (Ti,Nb),remnant Nb,remnant Cu and Cu(s.s).The shear strength of TiC/Ti-Nb-Cu/304SS joint can be up to 84.6 MPa when it is bonded at 925 ℃ for 20 rain under a pressure of 8 MPa.Failure occurs in TiC cermet near the interface in a brittle manner.The results indicate that Ti/Nb/Cu interlayer can effectively reduce the harmful effects of intermetallic compounds on the joint performance,and the Nb interlayer plays a major role in the relief of the residual stress.
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