对SiC颗粒增强6061铝基复合材料在一定的应变速率(0.0001 ～0.1 s-1)和一定的变形温度(300 ～ 450℃)下进行热压缩试验,对热变形行为进行分析.结果表明:复合材料流变应力随着应变速率的增大而增大,随着变形温度的升高而降低,呈现出正应变速率敏感性.复合材料的热流变行为可以用双曲正弦形式的本构方程来描述,并通过线性回归分析,计算出复合材料的应变敏感指数n为8.0678,变形激活能Q为366.27 kJ/mol,其变形机制为晶格扩散控制的弥散强化机制.同时,观察了复合材料微观变形组织,可以看出热压缩后晶粒明显被拉长,颗粒在变形过程中重新排布,但是在高温低应变速率下,因动态再结晶的发生,这种现象不是很明显.
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