采用熔融共混方法制备了苯乙烯-马来酸酐共聚物(SMA)增容的PA6/ARS共混物,结合吴守恒的临界基体层厚度(IDc)理论,考察了基体层厚度与界面粘接对PA6/ABS共混物脆一韧转变的影响.结果表明,温度低于8℃,当ID减小时,冲击强度先缓慢增加,当ID＜ID.时,共混物缺口冲击强度急剧增加;测试温度处于13℃～23℃时,PA6/ABS共混物要表现出超韧行为,必须同时满足形态(ID＜IDc)及界面粘接的要求;测试温度大于28℃时,共混物只需满足基体层厚度判据.PA6/ABS共混物的脆一韧转变既可在较小的基体层厚度、较低的温度下获得,也可在较大的基体层厚度、较高的温度下获得.
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