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以一种聚硅氧烷类有机硅树脂YR3370(GE Toshiba Silicones)为连接剂,连接了反应烧结SiC(RBSiC)陶瓷和高强石墨.连接件在1100~1400 ℃的99.99%N2气流中进行热处理.用X射线衍射仪和红外光谱仪分析有机硅树脂YR3370裂解产物的结构和变化,用扫描电镜观察连接件的显微结构,用材料试验机测定连接件的三点弯曲强度.连接温度为1300℃时,连接件的三点弯曲强度达最大值18.3 MPa,为石墨母材强度的45.8%.连接层是有机硅树脂YR3370裂解生成的无定形SixOyCz陶瓷,其结构连续均匀致密,厚度在2~5 μm之间.连接机理是无定形SixOyCz陶瓷对RBSiC和石墨基体的无机粘接作用.

参考文献

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