在含有CuCl的BMIC-ZnCl2(物质的量比为1∶2)离子液体中,采用恒电位法于低碳钢基体上进行了Cu-Zn合金电沉积实验.研究了CuCl的浓度、沉积电位、温度对Cu-Zn合金成分、形貌及电流效率的影响,并采用带X射线能量散射谱(EDS)的扫描电子显微镜(SEM)及X射线衍射仪对所得Cu-Zn合金沉积层的成分、表面形貌及物相进行分析.结果发现当电解液中CuCl的浓度为0.2mol/L时,阴极沉积电位在-0.1V附近,温度为70℃时,可得到质量较好的Cu-Zn合金仿金镀层.
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