针对真空辅助成型工艺(VARI)制备的泡沫夹芯壁板面-芯界面粘接强度较低的问题,提出铺放本体树脂胶膜和对芯材进行打孔两种解决方案.通过无损检测、三点弯曲力学性能测试、计算机模拟树脂充模流动以及微观界面结构观察,探究两种方案的可行性及改善效果,分析了胶膜的有无和厚度、打孔工艺参数对界面性能的影响.结果表明,在不加入胶膜时界面强度最高,胶膜厚度在0.5mm时,无损检测显示的界面缺陷最少,胶膜厚度达到2 mm后界面质量下降；合理设计芯材的打孔行、间距可以促进树脂充模流动,形成质量好的连续界面,同时还能提高结构刚度.
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