采用射频磁控溅射法在NiTi膜表面沉积一层非晶硅膜而形成NiTi/Si膜,并对该膜进行了不同温度的退火处理;用XRD、SEM和纳米压痕仪研究了退火温度对NiTi/Si膜的结晶特性和力学性能的影响.结果表明:NiTi/Si膜在600℃下退火后其中的硅仍为非晶态;当退火温度在650℃后开始出现明显的结晶硅衍射峰,且随着温度升高,硅的结晶度增大,晶粒逐渐长大;而该膜的硬度和抗压痕蠕变能力逐渐降低;该膜弹性模量在650℃退火后最大.
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