由于硅具有价格低、热导率高、大直径单晶生长技术成熟等优势以及在光电集成方面的应用潜力,GaN/Si基器件成为一个研究热点.然而,GaN与Si之间的热失配容易引起薄膜开裂,这是限制LED及其它电子器件结构生长的一个关键问题.近年来,随着工艺的发展,GaN晶体质量得到大幅度的提高.同时不少研究小组成功地在Si衬底上制造出LED.介绍了GaN薄膜开裂问题及近期硅衬底GaN基LED的研究进展.
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