采用97(72Ag-28Cu)-3Ti活性钎料钎焊了Diamond/Cu复合材料和Al2O3陶瓷,研究了主要钎焊条件如钎焊温度和保温时间对接头强度的影响.结果表明,钎焊过程中Ti元素易聚集在金刚石颗粒周围并形成TiC化合物层.TiC化合物的形貌与Diamond/Cu钎焊接头剪切强度有密切关系,金刚石表面生长适当厚度的TiC化合物层能增强钎焊接头的剪切强度,但如果TiC为颗粒状或TiC化合物层生长过厚,将削弱钎焊接头的剪切强度.钎焊接头的最大剪切强度可达117 MPa.
参考文献
| [1] | Carl Zweben .Thermal Materials Solve Power Electronics Challenges[J].Power Electronics Technology,2006(2):40-47. |
| [2] | Sergio Nogales;Helmut J. Boehm .Modeling of the thermal conductivity and thermomechanical behavior of diamond reinforced composites[J].International journal of engineering science,2008(6):606-619. |
| [3] | 童震松,沈卓身.金属封装材料的现状及发展[J].电子与封装,2005(03):6-15. |
| [4] | Wu, M;He, XB;Rafi-ud-din;Ren, SB;Qin, ML;Qu, XH .Effect of various Ni plating layers and aging on microstructure and shear strength of Sn-2.5Ag-2.0Ni solder joint[J].Surface & Coatings Technology,2009(20/21):3011-3018. |
| [5] | Wu M;He X B;Rafi-ud-din et al.Effect of P and aging on microstructure and shear strength of Sn-2.5Ag-2.0Ni/Ni(P) solder joints[J].Materials Chemistry and Physics,2010,121(1-2):259-266. |
| [6] | WU Mao,QU Xuan-hui,HE Xin-bo,Rafi-ud-din,REN Shu-bin,QIN Ming-li.Interfacial reactions between Sn-2.5Ag-2.0Ni solder and electroless Ni(P) deposited on SiCp/Al composites[J].中国有色金属学报（英文版）,2010(06):958-965. |
| [7] | Ren S B;He X B;Qu X H;Islam S H et al.Effect of calcinations process on the properties and microstructure of SiC perform and corresponding SiCp/Al composites synthesis by pressureless infiltration[J].Materials Science and Engineering A:Structural Materials Properties Microstructure and Processing,2007,444(1-2):104-112. |
| [8] | Katsuhito Yoshida;Hideaki Morigami .Thermal properties of diamond/copper composite material[J].Microelectronics and reliability,2004(2):303-308. |
| [9] | E.A. Ekimov;N.V. Suetin;A.F. Popovich .Thermal conductivity of diamond composites sintered under high pressures[J].Diamond and Related Materials,2008(4/5):838-843. |
| [10] | Yasuyukii A.Thermal conductivity of copper composites dispersed with diamond particles prepared by spark plasma sintering[A].Kyoto,Japan,2006:328-335. |
| [11] | R. Tavangar;J.M. Molina;L. Weber .Assessing predictive schemes for thermal conductivity against diamond-reinforced silver matrix composites at intermediate phase contrast[J].Scripta materialia,2007(5):357-360. |
| [12] | W.Z. Shao;V.V. Ivanov;L. Zhen .A study on graphitization of diamond in copper-diamond composite materials[J].Materials Letters,2004(1/2):146-149. |
| [13] | 沈卓身;贾松良.电子封装材料与工艺[M].北京:化学工业出版社,2006:85-141. |
| [14] | O. Kozlova;M. Braccini;R. Voytovych .Brazing copper to alumina using reactive CuAgTi alloys[J].Acta materialia,2010(4):1252-1260. |
| [15] | 卢金斌,徐九华.Ag-Cu-Ti钎料钎焊金刚石的界面微观组织分析[J].焊接学报,2007(08):29-32. |
| [16] | Fenglian Sun;Jicai Feng;Dan Li .Bonding of CVD diamond thick films using an Ag-Cu-Ti brazing alloy[J].Journal of Materials Processing Technology,2001(3):333-337. |
| [17] | Jin Hui Xiong;Ji Hua Huang;Hua Zhang;Xing Ke Zhao .Brazing of carbon fiber reinforced SiC composite and TC4 using Ag–Cu–Ti active brazing alloy[J].Materials Science & Engineering, A. Structural Materials: Properties, Misrostructure and Processing,2010(4/5):1096-1101. |
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