利用JSM-5610LV扫描电镜（SEM）及能谱分析（EDS）等测量方法,研究了微量RE对Sn-2.5Ag-0.7Cu无铅钎料的显微组织、润湿特性、拉伸强度及焊点剪切强度和蠕变断裂寿命的影响。结果表明,向Sn-2.5Ag-0.7Cu中添加0.1%RE可明显细化钎料合金的显微组织,改善钎料合金的润湿特性,提高钎料合金的抗拉强度、伸长率及焊点剪切强度,增加焊点的蠕变断裂寿命。当RE添加量为0.5%时,由于形成了RE化合物而明显恶化钎料合金的性能。
Effect of RE on microstructure,wetting property,tensile strength of Sn2.5Ag0.7Cu solder alloy and shear strength,creep rupture life of its solder joints were investigated by means of scanning electronic microscopy（SEM） and energy dispersive spectrum analysis.The results show that adding 0.1% RE in Sn2.5Ag0.7Cu solder alloy can apparently refine the microstructure,greatly improve its wetting properties,tensile strength and elongation of the solder alloy.Meanwhile,shear strength and creep rupture life of the solder joints significantly increase.However,the addition of an excessive amount of RE deteriorates the properties of SnAgCu alloy because of the formation of RE compound.
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