为研究大功率IGBT用环氧树脂灌封胶体系的流变性能，以黏度为数据基础，建立了与黏度数据基本吻合的流变学黏度模型方程，并分析环氧胶的使用工艺。结果表明：环氧树脂灌封胶在50～90℃内起始黏度低，可操作时间大于30 min，且后期固化速率较高，符合IGBT模块的灌封使用要求。建立的黏度模型方程能有效预测环氧胶体系的流变特性，并为拟订合理的工艺参数提供参考。
To study the rheological property of epoxy pouring sealant for high-power IGBT, based on the viscosity data, we built a rheological viscosity model equation which was coincide with the viscosity data, and the use technology of epoxy pouring sealant was analyzed. The results show that the initial viscosity of the epoxy pouring sealant ranging from 50 ℃ to 90 ℃ is low, the operating time is more than 30 min, and the curing rate at later stage is higher, which can satisfy the operating requirement of potting for high-power IGBT. The viscosity model equation can predict the viscosity behavior of epoxy pouring sealant effectively, which can provide reference to formulating reasonable process parameters.
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