研究Sip体积分数和实验温度对原位自生Sip/ZA27复合材料磨损性能的影响.结果表明:随着Sip体积分数的增加,其耐磨性呈先增大、后减小、进而又增大的趋势;随着实验温度的升高,复合材料的耐磨性减弱,但不同Sip体积分数的材料其耐磨性减小的幅度不同;所有这些变化均由磨损机理决定;随Sip体积分数的增加,材料的主导磨损机制将从较严重的磨损机制--塑性变形诱导磨损和粘着磨损转向轻微的磨损机制--咤余抹磨损,进而又转向严重的磨损机制--塑性变形诱导磨损,最后则义转变为相对轻微的磨损机制--伴随磨料磨损的涂抹;随着实验温度的升高,主导磨损机制从轻微的磨损机制--伴随磨料磨损的涂抹转向严重的磨损机制--塑性变形诱导磨损和粘着磨损;高硬度磨层的形成与否决定着Sip/ZA27复合材料的耐磨性及磨损机制.
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