Wei Zhang
材料科学技术(英文)
Diamond/SnAgCu composite solder bumps were prepared on Cu pad by mechanically incorporating diamond particles into Sn3.0Ag0.5Cu (SAC) solder powders, mixing with flux and reflowing at 260℃ for 60 seconds. Spreading areas of composite solder were calculated and distributions of copper-coated diamonds were characterized. When diamond additions are below 3wt%, the spreading area decreases with diamond additions, and diamonds distributes mainly at the interface between solder and Cu pad; however, when additions are beyond 3wt%, discharge of diamond particle occurs, and the spreading area increases due to the reduction of surface energy.
关键词:
Sn3.0Ag0.5Cu
Journal of Materials Research
The morphology of the dark and bright regions observed by transmission electron microscopy for the Zr(64.13)Cu(15.75)Ni(10.12)Al(10) bulk metallic glass strongly depends on the ion beam parameters used for ion milling. This indicates that the ion beam could introduce surface fluctuation to metallic glasses during ion milling.
关键词:
room-temperature